Patents by Inventor Kun-Tao Tang

Kun-Tao Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240023227
    Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.
    Type: Application
    Filed: July 14, 2022
    Publication date: January 18, 2024
    Inventors: Ching-Shan CHANG, Kun-Tao TANG, Tsung-Ting TSAI, Chien-Lin CHEN
  • Patent number: 11877385
    Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: January 16, 2024
    Assignee: FIRST HI-TEC ENTERPRISE CO., LTD.
    Inventors: Ching-Shan Chang, Kun-Tao Tang, Tsung-Ting Tsai, Chien-Lin Chen