Patents by Inventor Kun-Up Kim

Kun-Up Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7880493
    Abstract: In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: February 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kun-Up Kim, Chang-Sik Kim, Tae-Sik Son, Doo-Seon Lee
  • Publication number: 20100013506
    Abstract: In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.
    Type: Application
    Filed: September 25, 2009
    Publication date: January 21, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kun-Up KIM, Chang-Sik KIM, Tae-Sik SON, Doo-Seon LEE
  • Patent number: 7616020
    Abstract: In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: November 10, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kun-Up Kim, Chang-Sik Kim, Tae-Sik Son, Doo-Seon Lee
  • Patent number: 7612573
    Abstract: A probe sensing pad used to detect a position of a probe needle includes a probe area, at least two sensing regions contacting peripheral portions of the probe area, sensing elements of different electrical characteristics connected to corresponding sensing regions, and at least one isolation region for electrically insulting the sensing regions. The position of the probe needle relative to the probe sensing pad may be rapidly detected and automatically corrected toward a desired contact site of the probe sensing pad depending upon the voltage measured by a probe needle contacting the probe sensing pad. That is, the measured voltage will have a first value if deflected in a first direction, a second value (different from the first) if deflected in a second direction, and so on. The position of the probe needle can be corrected based on this measurement.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: November 3, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kun-Up Kim, Chang-Sik Kim, Doo-Seon Lee, Jong-Hyoung Lim
  • Publication number: 20070090851
    Abstract: A probe sensing pad used to detect a position of a probe needle includes a probe area, at least two sensing regions contacting peripheral portions of the probe area, sensing elements of different electrical characteristics connected to corresponding sensing regions, and at least one isolation region for electrically insulting the sensing regions. The position of the probe needle relative to the probe sensing pad may be rapidly detected and automatically corrected toward a desired contact site of the probe sensing pad depending upon the voltage measured by a probe needle contacting the probe sensing pad. That is, the measured voltage will have a first value if deflected in a first direction, a second value (different from the first) if deflected in a second direction, and so on. The position of the probe needle can be corrected based on this measurement.
    Type: Application
    Filed: November 30, 2006
    Publication date: April 26, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kun-Up KIM, Chang-Sik KIM, Doo-Seon LEE, Jong-Hyoung LIM
  • Publication number: 20050258854
    Abstract: In an embodiment, a semiconductor device is tested using a probe pad that includes a probing region with which a probe needle makes contact, and a sensing region bordering an edge of the probing region. Electrical signals are applied, and measured results indicate the probe needle's location relative to a test position on the semiconductor device.
    Type: Application
    Filed: May 17, 2005
    Publication date: November 24, 2005
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kun-Up Kim, Chang-Sik Kim, Tae-Sik Son, Doo-Seon Lee