Patents by Inventor Kun-woo Chang

Kun-woo Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240181517
    Abstract: A hot-stamped component according to an embodiment of the present disclosure includes a steel sheet, a plating layer located on the steel sheet and including Zn, and a surface layer located on the plating layer, wherein the surface layer includes a post-treatment layer including an Si-based inorganic post-treatment agent, a Zn oxide layer located on a same layer as the post-treatment layer on the plating layer, and an inter-diffusion layer located between the plating layer and at least one of the post-treatment layer and the Zn oxide layer to overlap at least one of the post-treatment layer and the Zn oxide layer, the inter-diffusion layer including at least one of Si, Mn, O, Fe, Zn, and SiO.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 6, 2024
    Inventors: Min Ho Jang, Kun Woo Chang
  • Publication number: 20240141473
    Abstract: A hot stamping component according to an embodiment of the present disclosure includes a steel sheet, a plating layer located on the steel sheet and including Zn, and a surface layer located on the plating layer, wherein the surface layer includes a post-treatment layer including an Si-based inorganic post-treatment agent, a Zn oxide layer located on a same layer as the post-treatment layer on the plating layer, and an inter-diffusion layer located between the plating layer and at least one of the post-treatment layer and the Zn oxide layer to overlap at least one of the post-treatment layer and the Zn oxide layer, the inter-diffusion layer including at least one of Si, Mn, O, Fe, Zn, and SiO, wherein a tensile strength of the steel sheet is 1680 MPa or more.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 2, 2024
    Inventors: Min Ho Jang, Kun Woo Chang
  • Publication number: 20070205670
    Abstract: An apparatus for generating a multiway packet is provided. The apparatus includes a setting module that sets a multiway switch group by selecting multiple switches; a packet-generating module that generates a data packet according to the set multiway switch group; and a transmission module that transmits the generated data packet to the multiple switches.
    Type: Application
    Filed: January 23, 2007
    Publication date: September 6, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Kun-woo Chang