Abstract: A LED lamp comprises a base, an envelope, a printed circuit board for mounting a plurality of LED chips and a supporting member for supporting the printed circuit board. The envelope has a bottom end coupled with the base. The envelope defines an interior between the base and the envelope, and the printed circuit board is disposed in the interior. The printed circuit board comprises a hollow structure. One end of the supporting member is assembled in the base, the other end of the supporting member is coupled with the printed circuit board. One end of the printed circuit board extends into the base.

Abstract: The present disclosure provides an end cap assembly, a lamp using the end cap assembly and a method of assembling the lamp. The end cap assembly includes an end cap, an isolation module, a mounting module, a conductive contact, a driving module and a potted material. The end cap defines therein an end cap interior chamber. The isolation module comprises a first end coupled to the end cap and a second end having a first opening. The mounting module is coupled to the isolation module and at least partially is accommodated in the first opening, and the mounting module has a second opening. The conductive contact is at least partially accommodated in the second opening. The driving module is at least partially accommodated in the end cap interior chamber. The potted material is filled in the end cap interior chamber and surrounding at least part of the driving module.

Abstract: The present disclosure includes an LED lamp assembly comprising a glass envelope, an LED platform supported by a stem arrangement disposed within the envelope, a base hermetically sealed to the envelope, a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope, and a getter disposed within the envelope for absorbing volatile organic compounds. The lamp may maintain a ratio of helium to oxygen that achieves both an acceptable thermal conductivity and an acceptable lumen output over the life of the LED lamp.

Abstract: The present disclosure is directed to compounds of Formula (I) and methods of their use and preparation, as well as compositions comprising compounds of Formula (I).

Abstract: An accelerator virtualization method is disclosed.

Abstract: The present disclosure is directed to compounds of formula I? and methods of their use and preparation, as well as compositions comprising compounds of formula I?.

Abstract: A lighting apparatus includes at least one light source generating a visible light and an optical component, the optical component includes a transparent, translucent or reflective substrate and a coating on a surface of the substrate to cause a color filtering effect to the visible light passing through the optical component, the coating includes a compound containing Nd3+ ions and F? ions.

Abstract: The present disclosure is directed to compounds of formula I? and methods of their use and preparation, as well as compositions comprising compounds of formula I?.

Abstract: The present disclosure is directed to compounds of formula I? and methods of their use and preparation, as well as compositions comprising compounds of formula I?.

Abstract: Aspects of the present disclosure provide an LED lamp assembly, comprising a glass envelope, an LED platform comprising a printed circuit board supported by a stem assembly disposed within the envelope, a base hermetically sealed to the envelope, and a gas disposed within the envelope. The gas is capable of providing both thermal conductivity between the LED platform and the envelope, while also mitigating volatile organic compounds present within the envelope.

Abstract: The present disclosure is directed to compounds of Formula (I) and methods of their use and preparation, as well as compositions comprising compounds of Formula (I).

Abstract: An LED lamp, comprising a base; a lamp envelope coupled to the base; a support module accommodated in the lamp envelope, a first inner cavity being formed between the support module and the lamp envelope, the first inner cavity containing therein a first gas medium; a driver module accommodated in the first inner cavity and coupled to the support module; and an LED inner vessel accommodated in the first inner cavity and coupled to at least one of the support module and the driver module, a sealed second inner cavity being formed within the LED inner vessel, and the second inner cavity containing therein a second gas medium and an LED light source module.

Abstract: The present invention comprises a type of connector used to electrically connect a light source board and a driver board in LED lighting equipment, and the LED lighting equipment that uses this connector. The connector is mounted on the light source board, and comprises two or more conduction terminals, each of which comprises at least one flexible arm whose points of contact with the driver board can achieve an electronic connection between the light source board and the driver board. Compared to earlier models, the connector structure of the present invention is simple and easy to assemble and fabricate, facilitating large-scale automated production of LED lighting equipment and helping to reduce costs.

Abstract: A LED lamp comprises a base, an envelope, a printed circuit board for mounting a plurality of LED chips and a supporting member for supporting the printed circuit board. The envelope has a bottom end coupled with the base. The envelope defines an interior between the base and the envelope, and the printed circuit board is disposed in the interior. The printed circuit board comprises a hollow structure. One end of the supporting member is assembled in the base, the other end of the supporting member is coupled with the printed circuit board. One end of the printed circuit board extends into the base.

Abstract: An accelerator virtualization method is disclosed.

Abstract: This invention relates to a method for making 32-bit addressing of SV data by utilizing FPGA, which may be applied to processing digital sampling data in an equipment of an intelligent substation. Specifically, the method includes the following steps: FPGA receiving naked SV data packages generated based on IEEE802.3 standard; analyzing data structure of Ethernet frame; based on characteristics of the Ethernet frame of the SV data, the SV data of the network byte sequence being reorganized by utilizing ASN.1 coding rules, so that the SV data being converted into a data that can be directly accessed by 32-bit addressing processors. As a result, SV data decoding efficiency is improved greatly. This invention may make the decoding efficiency of 32-bit addressing processor improved by 5-10 times, thus solve problem of declined efficiency due to processing network byte order by splitting and reorganization.