Patents by Inventor Kun-Yang Hsieh

Kun-Yang Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11121288
    Abstract: A package structure of a light-emitting element includes a shell, a first conductive path, a second conductive path, a light-emitting device, a cover, a first light-transmitting sensing electrode, and a second light-transmitting sensing electrode. The shell has a top surface and a bottom surface, and the top surface is recessed toward the bottom surface to form an accommodating space. Each of the first and second conductive paths extends from the top surface to the bottom surface. The light-emitting device is disposed in the accommodating space. The cover is disposed over the shell. The first and second light-transmitting sensing electrodes are disposed on the same surface of the cover, and a capacitance is formed between the first and second light-transmitting sensing electrodes. The first and second light-transmitting sensing electrodes are electrically connected to the first and second conductive paths, respectively.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: September 14, 2021
    Assignee: Lextar Electronics Corporation
    Inventors: Jung-Tang Chu, Kun-Yang Hsieh, Che-Hung Lin, Yu-Jen Cheng
  • Publication number: 20200227597
    Abstract: A package structure of a light-emitting element includes a shell, a first conductive path, a second conductive path, a light-emitting device, a cover, a first light-transmitting sensing electrode, and a second light-transmitting sensing electrode. The shell has a top surface and a bottom surface, and the top surface is recessed toward the bottom surface to form an accommodating space. Each of the first and second conductive paths extends from the top surface to the bottom surface. The light-emitting device is disposed in the accommodating space. The cover is disposed over the shell. The first and second light-transmitting sensing electrodes are disposed on the same surface of the cover, and a capacitance is formed between the first and second light-transmitting sensing electrodes. The first and second light-transmitting sensing electrodes are electrically connected to the first and second conductive paths, respectively.
    Type: Application
    Filed: December 16, 2019
    Publication date: July 16, 2020
    Inventors: Jung-Tang CHU, Kun-Yang HSIEH, Che-Hung LIN, Yu-Jen CHENG
  • Publication number: 20140145221
    Abstract: An LED lamp structure with a heat sink includes a reflection cup, an LED module, and a cover, in addition to the heat sink. The reflection cup has an inside bottom surface, a reflection surface, an outside bottom surface, and a light exit. The LED module is thermally conductively and fixedly provided on the inside bottom surface. The cover covers the LED module. The heat sink is thermally conductively connected to the outside bottom surface. The LED lamp structure is efficient in not only light extraction but also heat dissipation.
    Type: Application
    Filed: January 9, 2013
    Publication date: May 29, 2014
    Applicant: Helio Optoelectronics Corporation
    Inventors: Ming-Hung Chen, Kun-Yang Hsieh, Shin-Chieh Lin