Patents by Inventor Kun Yen

Kun Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250239449
    Abstract: A manufacturing method for a semiconductor device structure and the semiconductor device structure are disclosed. The method includes forming backside connection structures by sequentially forming heat transfer layers stacked upon one another and backside metallization structures sandwiched between the heat transfer layers. The formation of at least one heat transfer layer involves performing an annealing process to turn an insulating material layer into an insulating nanostructured material layer with nano grains and dopants distributed along grain boundaries of the nano grains.
    Type: Application
    Filed: January 24, 2024
    Publication date: July 24, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kun-Yen Liao, Ming-Hsien Lin, Yung-Chih Wang, Hsin-Ping Chen, Tsu-Chun Kuo, Meng-Pei Lu, Cheng-Chin Lee
  • Publication number: 20250234143
    Abstract: Provided is a hearing aid device that includes an earplug, a speaker, a handle, and at least one microphone. A structural profile of the earplug body is mirror symmetrical relative to a plane. The speaker is disposed in the earplug body. The handle extends out of the earplug body from a connection side of the earplug body, and a structural profile of the handle is mirror symmetrical relative to the plane. The microphone is disposed in one or both of the handle and the earplug body.
    Type: Application
    Filed: November 24, 2024
    Publication date: July 17, 2025
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ting-Chieh Huang, Kun-Yen Liu, Ting-Wei Wu, Shi-Kuan Chen
  • Publication number: 20250226278
    Abstract: A semiconductor structure includes a semiconductor die having a first region and a second region is provided. The semiconductor die includes a device layer located in the second region, an insulation material extending over the first and second regions, and metallization structures embedded in the insulation material and electrically connected with the device layer. The metallization structures include passive device structures located in the first region and thermal traces located in the second region, and the passive device structures and the thermal traces include a same material and are co-levelled. The passive device structures are electrically connected with the device layer, and the thermal traces are electrically floating.
    Type: Application
    Filed: January 10, 2024
    Publication date: July 10, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Hsien Lin, Kun-Yen Liao, Chia-Tien Wu
  • Publication number: 20250140697
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a plurality of conductive interconnects arranged within a dielectric structure having a plurality of inter-level dielectric (ILD) layers stacked onto one another. A heat pipe vertically extends through the plurality of ILD layers. A high thermal conductivity layer is sandwiched between neighboring ones of the plurality of ILD layers. The high thermal conductivity layer laterally extends from over one or more of the plurality of conductive interconnects to the heat pipe.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 1, 2025
    Inventors: Ming-Hsien Lin, Kun-Yen Liao, Hsin-Ping Chen, Chia-Tien Wu, Hsiao-Kang Chang
  • Publication number: 20250140644
    Abstract: A contact structure according to the present disclosure includes a conductive feature, an etch stop layer (ESL) over the conductive feature, a dielectric layer over the ESL, and a contact feature extending through the dielectric layer and the ESL to contact the conductive feature. The dielectric layer includes a low-k dielectric matrix material, and nano-pipes disposed in the low-k dielectric matrix material and configured to reduce a thermal resistance of the dielectric layer.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 1, 2025
    Inventors: Ming-Hsien Lin, Wen-Che Liao, Kun-Yen Liao, Hsiao-Kang Chang
  • Publication number: 20250080211
    Abstract: An antenna structure includes an upper patch antenna, a lower patch antenna, a grounding layer, a transmission line layer, and a first feeding line and a second feeding line passing through the grounding layer. Each of the first feeding line and the second feeding line includes a first portion, a second portion and a third portion. The first portion is disposed between the lower patch antenna and the grounding layer and is perpendicular to the grounding layer. The second portion is disposed between the grounding layer and the transmission line layer and is perpendicular to the grounding layer. The third portion is disposed within the grounding layer and is parallel to the grounding layer. The third portion is coupled between the first portion and the second portion.
    Type: Application
    Filed: June 20, 2024
    Publication date: March 6, 2025
    Inventors: Kun Yen TU, Meng-Hua TSAI, Sin-Siang WANG, Wei Ting LEE, Ming-Hsiang HUANG
  • Publication number: 20250023223
    Abstract: An antenna module and a portable electric device are provided. The antenna module includes a flexible substrate, a first antenna circuit and a second antenna circuit. Each of an L-shaped bent portion and a U-shaped bent portion of the flexible substrate has a first end and a second end opposite to each other. The first end of the L-shaped bent portion is connected to a first main body of the flexible substrate. The first end of the U-shaped bent portion is connected to the second end of the L-shaped bent portion. The second end of the U-shaped bent portion is connected to a second main body of the flexible substrate. The first antenna circuit and the second antenna circuit are respectively disposed on the first main body and the second main portion. The portable electric device includes a casing and the antenna module disposed at a corner.
    Type: Application
    Filed: June 20, 2024
    Publication date: January 16, 2025
    Inventors: Kun Yen TU, Po-Ting CHEN, Sin-Siang WANG, Wei Ting LEE
  • Patent number: 12191900
    Abstract: A millimeter wave radio frequency (RF) structure uses a substrate including a liquid-crystal polymer material, at least one dual-polarized antenna, a RF transceiver module, and a switching module electrically connected to the at least one dual-polarized antenna and the RF transceiver module, where the switching module includes a first switching element and a second switching element electrically connected to the at least one dual-polarized antenna, and a third switching element electrically connected to the first switching element and the second switching element, to enhance characteristics of a liquid-crystal polymer (LCP) substrate for millimeter waves, and implement high-frequency, high-speed transmission while ensuring high reliability.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: January 7, 2025
    Assignee: QUANTUMZ INC.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang, Gang-Lin Zhang
  • Publication number: 20240223150
    Abstract: A Balun filter is disposed on a circuit board, and includes a first wire, a second wire, a third wire and a ground plane. The first wire has one end for disposing a first feeding point. The second wire has one end for disposing a second feeding point. The third wire is configured for disposing a third feeding point and includes a first coupling section, a second coupling section, a first central section and a second central section. The third feeding point is located between the first central section and the second central section, and the first coupling section, the first central section, the second central section and the second coupling section are electrically connected in sequence. In a parallel direction of the first wire, the first feeding point and the second feeding point are located in two opposite directions, respectively, relative to the third feeding point.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 4, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Publication number: 20240154629
    Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Publication number: 20240097300
    Abstract: A multi-band filter includes a circuit board, a first resonator, a second resonator, and a coupling element configured to couple the first resonator with the second resonator. The coupling element includes a first coupling capacitor, a second coupling capacitor, a first short-circuited stub and a second short-circuited stub. The first coupling capacitor has two terminals electrically connected to the first portion of the first resonator and the first portion of the second resonator respectively. The second coupling capacitor has two terminals electrically connected to the second portion of the first resonator and the second portion of the second resonator respectively. The first short-circuited stub is electrically connected to the first coupling capacitor and a ground plane. The second short-circuited stub is electrically connected to the second coupling capacitor and a ground plane.
    Type: Application
    Filed: June 20, 2023
    Publication date: March 21, 2024
    Inventors: Kun Yen TU, Meng-Hua TSAI, Weiting LEE, Sin-Siang WANG
  • Patent number: 11916313
    Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 27, 2024
    Assignee: QuantumZ Inc.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Patent number: 11705636
    Abstract: A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: July 18, 2023
    Assignee: QUANTUMZ INC.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Publication number: 20230033109
    Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.
    Type: Application
    Filed: March 29, 2022
    Publication date: February 2, 2023
    Inventors: Kun-Yen TU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG
  • Publication number: 20230030634
    Abstract: A millimeter wave radio frequency (RF) structure uses a substrate including a liquid-crystal polymer material, at least one dual-polarized antenna, a RF transceiver module, and a switching module electrically connected to the at least one dual-polarized antenna and the RF transceiver module, where the switching module includes a first switching element and a second switching element electrically connected to the at least one dual-polarized antenna, and a third switching element electrically connected to the first switching element and the second switching element, to enhance characteristics of a liquid-crystal polymer (LCP) substrate for millimeter waves, and implement high-frequency, high-speed transmission while ensuring high reliability.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 2, 2023
    Inventors: Kun-Yen TU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG, Gang-Lin ZHANG
  • Publication number: 20230006353
    Abstract: A coupled array antenna includes a feeding network layer and a plurality of patch antennas disposed on the feeding network layer. A first patch antenna is disposed on the feeding network layer, and a second patch antenna is disposed above and coupled to the first patch antenna without contacting. A plurality of coupled array antennas are connected in series through microstrips to form a coupled array antenna device to maximize the antenna gain and bandwidth.
    Type: Application
    Filed: February 25, 2022
    Publication date: January 5, 2023
    Inventors: Kun-Yen TU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG
  • Publication number: 20220407232
    Abstract: A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.
    Type: Application
    Filed: January 27, 2022
    Publication date: December 22, 2022
    Inventors: Kun-Yen TU, Meng-Hua TSAI, Wei-Ting LEE, Sin-Siang WANG
  • Patent number: 11355040
    Abstract: A method for inspecting functionality of a display device and a test equipment are provided. The method for inspecting functionality of the display device is utilized in a test equipment of an auto-test system. The method includes controlling an image capturing device to capture a test image shown on a screen of the display device for generating a captured image, acquiring an encoded pattern from the captured image and decoding the encoded pattern, wherein the test image is a source image generated by an image providing device superposed with the encoded pattern, determining whether the encoded pattern is successfully decoded to generate a resultant data, and comparing the resultant data with reference data to generate a comparison result after the encoded pattern is successfully decoded, wherein the reference data comprises information associated with the test image and information associated with system configuration of the display device.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: June 7, 2022
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Sheng-Nan Sun, Jia-yu Wang, Chi-Cheng Hung, Kun-Yen Wu
  • Publication number: 20220148469
    Abstract: A method for inspecting functionality of a display device and a test equipment are provided. The method for inspecting functionality of the display device is utilized in a test equipment of an auto-test system. The method includes controlling an image capturing device to capture a test image shown on a screen of the display device for generating a captured image, acquiring an encoded pattern from the captured image and decoding the encoded pattern, wherein the test image is a source image generated by an image providing device superposed with the encoded pattern, determining whether the encoded pattern is successfully decoded to generate a resultant data, and comparing the resultant data with reference data to generate a comparison result after the encoded pattern is successfully decoded, wherein the reference data comprises information associated with the test image and information associated with system configuration of the display device.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 12, 2022
    Inventors: Sheng-Nan Sun, Jia-yu Wang, Chi-Cheng Hung, Kun-Yen Wu
  • Patent number: D1083103
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: July 8, 2025
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chien Chiu, Kun-Yen Liu, Tzu-Chien Lai, I-Hsuan Tsai, Yu-Chieh Lin