Patents by Inventor Kun-Yi Li

Kun-Yi Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10297690
    Abstract: A semiconductor device includes a gate structure formed over a channel region of the semiconductor device, a source/drain region adjacent the channel region, and an electrically conductive contact layer over the source/drain region. The source/drain region includes a first epitaxial layer having a first material composition and a second epitaxial layer formed over the first epitaxial layer. The second epitaxial layer has a second material composition different from the first composition. The electrically conductive contact layer is in contact with the first and second epitaxial layers. A bottom of the electrically conductive contact layer is located below an uppermost portion of the first epitaxial layer.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: May 21, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kun-Mu Li, Liang-Yi Chen, Wen-Chu Hsiao
  • Patent number: 8257807
    Abstract: A double-layer container includes an outer layer and an inner layer, both of which are formed by molding. The outer layer includes a 3-D pattern. The 3-D pattern has at least two pattern units each having at least one first groove which communicates with at least one through hole. The through hole is defined through the outer layer. At least one first slot is defined between the pattern units. The inner layer is fixed to an inner surface of the outer layer and the material of the inner layer is filled in the first groove via the through hole to form a first decoration portion.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: September 4, 2012
    Assignee: Immanuel Industrial Co, Ltd
    Inventor: Kun-Yi Li
  • Publication number: 20110091670
    Abstract: A double-layer container includes an outer layer and an inner layer, both of which are formed by molding. The outer layer includes a 3-D pattern. The 3-D pattern has at least two pattern units each having at least one first groove which communicates with at least one through hole. The through hole is defined through the outer layer. At least one first slot is defined between the pattern units. The inner layer is fixed to an inner surface of the outer layer and the material of the inner layer is filled in the first groove via the through hole to form a first decoration portion.
    Type: Application
    Filed: December 8, 2009
    Publication date: April 21, 2011
    Inventor: Kun-Yi LI
  • Patent number: D642839
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: August 9, 2011
    Inventor: Kun-Yi Li
  • Cup
    Patent number: D644880
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: September 13, 2011
    Inventor: Kun-Yi Li
  • Patent number: D658415
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: May 1, 2012
    Inventor: Kun-Yi Li
  • Patent number: D803598
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: November 28, 2017
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D805804
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: December 26, 2017
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D805807
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: December 26, 2017
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Cup
    Patent number: D808726
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: January 30, 2018
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D811767
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: March 6, 2018
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Cup
    Patent number: D819405
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 5, 2018
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D821796
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: July 3, 2018
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D821884
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: July 3, 2018
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D825879
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: August 14, 2018
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D845025
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: April 9, 2019
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D845666
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: April 16, 2019
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D850274
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: June 4, 2019
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D851423
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: June 18, 2019
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li
  • Patent number: D854937
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: July 30, 2019
    Assignee: Immanuel Industrial Co., Ltd.
    Inventor: Kun-Yi Li