Patents by Inventor Kun-Yu Huang

Kun-Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11784631
    Abstract: A resonance element supported by a bearing structure includes a crystal chip and an excitation electrode. The crystal chip includes a main surface having a support surface portion being in contact with the bearing structure. The excitation electrode is disposed on the main surface, has an electrode area, and includes an electrode indentation boundary partly encompassing the support surface portion. The electrode indentation boundary has a first boundary end and a second boundary end being opposite to the first boundary end. The electrode indentation boundary and a reference line segment defined by the first and the second boundary ends form an electrode indentation region having an indentation area. A ratio of the indentation area to the electrode area ranges from 0.05 to 0.2.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: October 10, 2023
    Assignee: TAI-SAW TECHNOLOGY CO., LTD.
    Inventors: Chia-Haur Rau, Kun-Yu Huang, Chi-Yun Chen
  • Patent number: 11764756
    Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: September 19, 2023
    Assignee: TAI-SAW TECHNOLOGY CO., LTD.
    Inventors: Cheng-Kang Peng, Kun-Yu Huang, Chi-Yun Chen, Song Tian, Tsung-Pin Yang
  • Publication number: 20220294419
    Abstract: A resonance element supported by a bearing structure includes a crystal chip and an excitation electrode. The crystal chip includes a main surface having a support surface portion being in contact with the bearing structure. The excitation electrode is disposed on the main surface, has an electrode area, and includes an electrode indentation boundary partly encompassing the support surface portion. The electrode indentation boundary has a first boundary end and a second boundary end being opposite to the first boundary end. The electrode indentation boundary and a reference line segment defined by the first and the second boundary ends form an electrode indentation region having an indentation area. A ratio of the indentation area to the electrode area ranges from 0.05 to 0.2.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 15, 2022
    Applicant: TAI-SAW Technology Co., Ltd.
    Inventors: Chia-Haur Rau, Kun-Yu Huang, Chi-Yun Chen
  • Publication number: 20210384888
    Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 9, 2021
    Applicant: TAI-SAW Technology Co., Ltd.
    Inventors: Cheng-Kang Peng, Kun-Yu Huang, Chi-Yun Chen, Song Tian, Tsung-Pin Yang