Abstract: The present invention provides a wide-filed spectral imaging system including a laser generator, a wavelength adjustment module, an objective lens, and a single-pixel imaging and a spectral separating module. The laser generator is configured to generate a laser excitation beam. The wavelength adjustment module is configured to disperse the laser excitation beam into a plurality of beams of different wavelengths. The objective lens is configured to focus the plurality of beams of different wavelengths on a sample to excite molecules under test in the sample and generate an emission light. The single-pixel imaging and spectral separating module is configured to generate a series of patterns and modulate the emission light with the series of patterns to generate a diffracted beam. The single-pixel imaging and spectral separating module further disperses the wavelength of the diffracted beam, collects light signals of the expanded diffracted beam, and performs a spectral image reconstruction.

Abstract: A sensing substrate including a substrate, a quantum well structure, a sensing surface and metal nanoparticles is provided. The quantum well structure is disposed on the substrate, and the quantum well structure includes at least one first metal nitride layer and second metal nitride layers. The first metal nitride layers and the second metal nitride layers are stacked on the substrate in alternation manner. The quantum well structure is located between the sensing surface and the substrate. The metal nanoparticles are disposed on the sensing surface, and the sensing surface is a rough surface. A manufacturing method of the sensing substrate and a sensor are also provided.

Abstract: A sensing substrate including a substrate, a quantum well structure, a sensing surface and metal nanoparticles is provided. The quantum well structure is disposed on the substrate, and the quantum well structure includes at least one first metal nitride layer and second metal nitride layers. The first metal nitride layers and the second metal nitride layers are stacked on the substrate in alternation manner. The quantum well structure is located between the sensing surface and the substrate. The metal nanoparticles are disposed on the sensing surface, and the sensing surface is a rough surface. A manufacturing method of the sensing substrate and a sensor are also provided.

Abstract: The disclosure provides a zinc oxide anti-reflection layer having a syringe-like structure and method for fabricating the same. The zinc oxide anti-reflection layer includes: a zinc oxide lower portion, wherein the zinc oxide lower portion has a nanorod array structure; and a zinc oxide upper portion connected to the zinc oxide lower portion, wherein the zinc oxide anti-reflection layer has a syringe-like structure.

Abstract: The disclosure provides a zinc oxide anti-reflection layer having a syringe-like structure and method for fabricating the same. The zinc oxide anti-reflection layer includes: a zinc oxide lower portion, wherein the zinc oxide lower portion has a nanorod array structure; and a zinc oxide upper portion connected to the zinc oxide lower portion, wherein the zinc oxide anti-reflection layer has a syringe-like structure.

Abstract: A method for dicing a semiconductor wafer includes the steps of: forming grooves in an integrated circuit layer of the semiconductor wafer; forming a photoresist layer on the integrated circuit layer; forming V-shaped first notches, each of which is further indented from the integrated circuit layer; thinning the substrate; attaching a blue tape to the integrated circuit layer; forming V-shaped second notches, each of which is indented from the thinned substrate and each of which is registered with a respective one of the first notches such that the first and second notches cooperatively define imaginary breaking lines, respectively; and pressing the blue tape at positions that are aligned with the imaginary breaking lines, respectively.

Abstract: A method for making a semiconductor light emitting device comprises the steps of: (a) forming a plurality of buttresses on a first supporting substrate such that the buttresses are separated by a plurality of intercommunicated spaces thereamong; (b) forming a base layer on top end portions of the buttresses in such a manner that the top end portions of the buttresses are enclosed in the base layer; (c) forming a multi-layered light-emitting structure on the base layer; (d) attaching a second supporting substrate to the light-emitting structure; and (e) separating the first supporting substrate from the light-emitting structure by destroying the buttresses.

Abstract: A method for making a semiconductor light emitting device comprises the steps of: (a) forming a plurality of buttresses on a first supporting substrate such that the buttresses are separated by a plurality of intercommunicated spaces thereamong; (b) forming a base layer on top end portions of the buttresses in such a manner that the top end portions of the buttresses are enclosed in the base layer; (c) forming a multi-layered light-emitting structure on the base layer; (d) attaching a second supporting substrate to the light-emitting structure; and (e) separating the first supporting substrate from the light-emitting structure by destroying the buttresses.