Patents by Inventor Kunakorn Kaoson

Kunakorn Kaoson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE MECHANICAL STABILITY AND HEAT DISSIPATION
    Publication number: 20220270942
    Abstract: A flip chip package is disclosed. The package includes a leadframe surrounding a flip chip. The leadframe and flip chip are encapsulated by a mold compound. The leadframe provides package support to enhance the mechanical stability of the package. In some cases, a heat dissipating structure is disposed on top of the package, connecting the flip chip to enhance heat dissipation.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 25, 2022
    Inventors: Nataporn Charusabha, Kunakorn Kaoson, Saravuth Sirinorakul, Sukhontip Jaikongkaew, Il Kwon Shim