Patents by Inventor Kunal A. Shah

Kunal A. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210193346
    Abstract: A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 24, 2021
    Applicant: LILOTREE, L.L.C.
    Inventors: Kunal Shah, Purvi Shah
  • Publication number: 20210136041
    Abstract: Systems and methods include, responsive to a request from a user for one or more Business-to-Business (B2B) applications, redirecting the request, by a cloud-based system, to an identity provider to authorize the user; displaying the one or more B2B applications that the user is authorized to access; responsive to a selection of a B2B application of the one or more B2B applications, creating a first tunnel from the B2B application to the cloud-based system; and stitching the first tunnel between the B2B application and the cloud-based system with a second tunnel between the user and the cloud-based system. The systems and methods further include, responsive to the user being unauthorized for any of the one or more B2B applications, omitting the one or more B2B applications from the displaying, such that the one or more B2B applications are invisible to the user.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Inventors: Patrick Foxhoven, John A. Chanak, William Fehring, Manoj Apte, Kunal Shah, Dhawal Sharma
  • Publication number: 20210110471
    Abstract: The present disclosure provides methods and systems for collecting and processing user transaction information for determining a financial profile associated with an income generating activity of a user. One exemplary method comprises: accessing email data associated with a user of an account associated with a financial service; monitoring a user financial profile by scanning the email data associated with the user and identifying email messages including transaction information associated with an income generating activity; extracting income information by determining an amount of payment to the user from the identified email messages; determining user income associated with the income generating activity within a previous period based on the extracted income information; and generating, based on the user income within the previous period, an output indicating an adjustment of at least one service term of the account of the financial service.
    Type: Application
    Filed: October 10, 2019
    Publication date: April 15, 2021
    Applicant: Capital One Services, LLC
    Inventors: Kunal SHAH, Ponnazhakan SUBRAMANIAN, Sasi Kumar UNNIKRISHNAN, Venkata Satya PARCHA, Satish CHIKKAVEERAPPA
  • Patent number: 10902967
    Abstract: A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: January 26, 2021
    Inventors: Kunal Shah, Purvi Shah
  • Patent number: 10875786
    Abstract: A water purifier includes a water purifier body including a housing and a filter provided in the housing to filter raw water introduced from outside of the water purifier body. A water discharge module including a water discharge nozzle is disposed on a front surface of the water purifier body to supply the water passing through the filter to the outside of the water purifier body. The water discharge module includes a case from which the water discharge nozzle extends at a lower end of the case. A protection cap is detachably coupled to the lower end of the case to cover at least a portion of the water discharge nozzle extending outside of the case.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: December 29, 2020
    Assignee: LG Electronics Inc.
    Inventors: Munjae Jang, Seungdon Lee, Bonghee Won, Chetan Sorab, Kunal Shah, Rajesh Karedla
  • Publication number: 20200348017
    Abstract: A pre-startup control method for a boiler or water heater includes: providing a controller operatively coupled to a boiler or water heater unit; performing a unit shutdown operation; enabling a pre-start up mode; at about a same time or in any order, moving an air fuel valve by a controller to a non-off position with a gas supply to the water heater or boiler turned off, wherein the controller turns on a blower at an operational level, and causes an ignitor to spark; and displaying parameters which allow an affirmation of a safe and reliable ignition prior to a gas turn on of the boiler or water heater unit. A flow balancing method and a programmed auto run method are also described.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 5, 2020
    Inventors: Kunal Shah, Nery Hernandez, Scott McGrath, Joseph Bentitou
  • Publication number: 20200213929
    Abstract: A solar-powered device (SPD) node operates as an access point for leaf nodes. The SPD node load balances network traffic received from leaf nodes across different backhaul networks. The SPD node determines a specific backhaul network across which to route the network traffic based on several different factors associated with the SPD node. Those factors include a current battery level, a current solar generation rate, and a current communication link status. The SPD access point also determines the specific backhaul network across which to route the network traffic based on characteristics of the different backhaul networks, including a network latency, among other characteristics.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 2, 2020
    Inventors: Bruce EDWARDS, Kunal SHAH
  • Publication number: 20200213930
    Abstract: A solar-powered device (SPD) relay node is coupled to a remotely-located “leaf” node in order to provide the leaf node with network access. The SPD relay node routes network traffic to and from the leaf node via one or more different paths that traverse other SPD relay nodes that reside upstream of the SPD relay node. The SPD relay node determines a specific path across which to route the network traffic based on several different factors associated with the upstream SPD relay nodes, including battery level, solar generation rate, and link quality. The SPD relay node generates a routing metric for each upstream SPD relay node based on these different factors and then routes traffic across the upstream SPD relay nodes based on the routing metric and based on a priority level associated with the network traffic.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 2, 2020
    Inventors: Bruce EDWARDS, Kunal SHAH
  • Publication number: 20200195614
    Abstract: Systems and methods, in a lightweight connector including a processor communicatively coupled to a network interface, include connecting to a cloud-based system, via the network interface; connecting to one or more of a file share and an application, via the network interface; and providing access to a user device to the one or more of the file share and the application via a stitched connection between the network interface and the user device through the cloud-based system. The systems and methods can further include receiving a query for discovery; and responding to the query based on the one or more of the file share and the application connected thereto.
    Type: Application
    Filed: February 25, 2020
    Publication date: June 18, 2020
    Inventors: John A. Chanak, Patrick Foxhoven, William Fehring, Denzil Wessels, Kunal Shah, Subramanian Srinivasan
  • Publication number: 20200154575
    Abstract: A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.
    Type: Application
    Filed: March 10, 2018
    Publication date: May 14, 2020
    Inventors: Kunal Shah, Purvi Shah
  • Patent number: 10616180
    Abstract: Virtual private access systems and methods implemented in a clientless manner on a user device are disclosed. The systems and methods include receiving a request to access resources from a Web browser on the user device at an exporter in a cloud system. The resources are located in one of a public cloud and an enterprise network and the user device is remote therefrom on the Internet. The systems and methods also include performing a series of connections between the exporter and i) the Web browser and ii) centralized components to authenticate a user of the user device for the resources. The systems and methods further include, subsequent to authentication, exchanging data between the Web browser and the resources through the exporter. The exporter has a first secure tunnel to the Web browser and a second secure tunnel to the resources.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: April 7, 2020
    Assignee: Zscaler, Inc.
    Inventors: John A. Chanak, Patrick Foxhoven, William Fehring, Denzil Wessels, Kunal Shah, Subramanian Srinivasan
  • Publication number: 20200090829
    Abstract: A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: LILOTREE, L.L.C.
    Inventors: Kunal Shah, Purvi Shah
  • Patent number: 10566103
    Abstract: A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: February 18, 2020
    Inventors: Kunal Shah, Purvi Shah
  • Patent number: 10503447
    Abstract: Example implementations relate to print fluid selection. For example, a system for print fluid detection may include a cloud-based printing platform coupled to a plurality of printing devices. A print fluid selection module may be implemented in the cloud-based printing platform. The print fluid selection module may determine a type of document to be printed by a printing device among the plurality of printing devices, and select a print fluid setting among a plurality of print fluid settings for printing the document, based on the determined document type. The printing fluid selection may be enabled only for printing devices that include authentic components, as verified by a printing supply verification module.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: December 10, 2019
    Assignee: Hewlett-Packard Development Company, L. P.
    Inventors: Kirti Kunal Shah, Satish Babu Natarajan
  • Patent number: D863231
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: October 15, 2019
    Assignee: Aerco International, Inc.
    Inventors: Desmond Brown, Joseph Pagliaccio, Kunal Shah, Nery Hernandez, Polina Fridman
  • Patent number: D898767
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: October 13, 2020
    Assignee: Aerco International, Inc.
    Inventors: Kunal Shah, Nery Hernandez, Joseph Bentitou, Polina Fridman
  • Patent number: D900852
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: November 3, 2020
    Assignee: Aerco International, Inc.
    Inventors: Kunal Shah, Nery Hernandez, Joseph Bentitou, Polina Fridman
  • Patent number: D900853
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: November 3, 2020
    Assignee: Aerco International, Inc.
    Inventors: Kunal Shah, Nery Hernandez, Joseph Bentitou, Polina Fridman
  • Patent number: D900854
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: November 3, 2020
    Assignee: Aerco International, Inc.
    Inventors: Kunal Shah, Nery Hernandez, Joseph Bentitou, Polina Fridman
  • Patent number: D921030
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: June 1, 2021
    Inventors: Kunal Shah, Nery Hernandez, Joseph Bentitou, Polina Fridman