Patents by Inventor Kunal Gaurang Shah

Kunal Gaurang Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10093081
    Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: October 9, 2018
    Assignee: Cytec Technology Corp.
    Inventors: Yiqiang Zhao, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Publication number: 20170066226
    Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 9, 2017
    Applicant: Cytec Technology Corp.
    Inventors: Yiqiang ZHAO, Dalip Kumar KOHLI, Kunal Gaurang SHAH
  • Patent number: 9473459
    Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: October 18, 2016
    Assignee: Cytec Technology Corp.
    Inventors: Yiqiang Zhao, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8974905
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: March 10, 2015
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Publication number: 20150030844
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Application
    Filed: October 13, 2014
    Publication date: January 29, 2015
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8895148
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: November 25, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8779035
    Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: July 15, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Kunal Gaurang Shah, Dalip Kumar Kohli
  • Publication number: 20100247922
    Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.
    Type: Application
    Filed: March 30, 2010
    Publication date: September 30, 2010
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Kunal Gaurang Shah, Dalip Kumar Kohli