Patents by Inventor Kun Bae Noh

Kun Bae Noh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP SLURRY COMPOSITION FOR POLISHING COPPER LAYER AND METHOD OF POLISHING COPPER LAYER USING THE SAME
    Publication number: 20260159736
    Abstract: Disclosed herein are a CMP slurry composition for polishing a copper layer, and a method of polishing a copper layer using the CMP slurry. The CMP slurry composition includes at least one solvent among a polar solvent and a nonpolar solvent, an abrasive agent, and a dishing and erosion inhibitor. The dishing and erosion inhibitor includes a mixture of a copolymer of acrylic acid and acrylamide, and a phosphorus compound.
    Type: Application
    Filed: December 2, 2025
    Publication date: June 11, 2026
    Applicant: SAMSUNG SDI CO., LTD.
    Inventors: Hye Youn JANG, Soo Yeon SIM, Dong Hun KANG, Won Jong JEONG, Se I MOON, Kun Bae NOH
  • CMP SLURRY COMPOSITION FOR POLISHING PATTERNED TUNGSTEN WAFER AND METHOD OF POLISHING PATTERNED TUNGSTEN WAFER USING THE SAME
    Publication number: 20260139154
    Abstract: Disclosed herein are a CMP slurry composition for polishing patterned tungsten wafers, and a method of polishing patterned tungsten wafers using the CMP slurry composition. The CMP slurry composition includes at least one of a polar solvent and a nonpolar solvent, an abrasive agent, and a catalyst. The catalyst includes a copper-containing catalyst, the copper-containing catalyst being a complex of a copper cation and a complexing agent having a charge of +1 or more at a pH in a range of 3 to 6.
    Type: Application
    Filed: November 12, 2025
    Publication date: May 21, 2026
    Applicant: SAMSUNG SDI CO., LTD.
    Inventors: Ji Ho LEE, Ji Hye KIM, Jin Gyo KIM, Eui Rang LEE, Ji Won BAEK, A Reum JUNG, Jun Ho YUN, Eun Bi PARK, Min A KWON, Kun Bae NOH
  • CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD FOR POLISHING TUNGSTEN USING THE SAME
    Publication number: 20250223479
    Abstract: A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the composition, the composition includes a solvent, the solvent comprising a polar solvent or a nonpolar solvent; an abrasive agent; and a corrosion inhibitor, wherein the corrosion inhibitor includes a polyaminosilane having a weight average molecular weight of 500 g/mol to 5,000 g/mol, or a salt thereof.
    Type: Application
    Filed: December 31, 2024
    Publication date: July 10, 2025
    Inventors: Eui Rang LEE, Kun Bae NOH, Tae Won PARK, Ji Ho LEE, Byung Chang OH, Ji won BAEK, A Reum JUNG, Keun Sam JANG
  • Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same
    Patent number: 7825528
    Abstract: An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4?-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: November 2, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Jo Gyun Kim, Kun Bae Noh, Yoon Kok Park