Patents by Inventor Kung-Chu CHEN

Kung-Chu CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230343859
    Abstract: A semiconductor device includes a substrate, a sensing device, and a transistor. The sensing device includes a dielectric layer, a sensing pad, a first sensing electrode, and a second sensing electrode. The dielectric layer is over the substrate. The sensing pad is over and in contact with the dielectric layer. The first sensing electrode and the second sensing electrode are over and in contact with the dielectric layer. The first sensing electrode and the second sensing electrode surround the sensing pad, and a distance between the first sensing electrode and the second sensing electrode is greater than a distance between the sensing pad and the first sensing electrode. The transistor is over the substrate. A gate of the transistor is connected to the sensing pad.
    Type: Application
    Filed: April 23, 2022
    Publication date: October 26, 2023
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Jenn-Gwo HWU, Jen-Hao CHEN, Kung-Chu CHEN