Patents by Inventor Kung-Hua CHENG

Kung-Hua CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20230369151
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first transparent substrate, a conductive layer, an insulating protective layer, a second transparent substrate, a device substrate, and a bonding layer. The first transparent substrate has a first surface and an opposite second surface. The conductive layer is disposed on the second surface of the first transparent substrate. The insulating protective layer covers the conductive layer and the first transparent substrate. The second transparent substrate is disposed above the first transparent substrate, and has a first surface facing the first transparent substrate and an opposite second surface. The device substrate is disposed on the second surface of the second transparent substrate. The bonding layer is bonded to the insulating protective layer and the first surface of the second transparent substrate.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 16, 2023
    Inventors: Hsiao-Lan YEH, Chin-Kang CHEN, Kung-Hua CHENG, Szu-Hui MA LEE, Chi-Jia TONG