Patents by Inventor Kung Ting Tsai

Kung Ting Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240203906
    Abstract: A method for forming a package structure is provided, which includes recessing a substrate to form a trench, disposing a first stacked die package structure over the substrate, forming an underfill layer over the first stacked die package structure and in the trench, and forming a package layer over the underfill layer and in the trench.
    Type: Application
    Filed: February 28, 2024
    Publication date: June 20, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu TSAI, Kung-Chen YEH, I-Ting HUANG, Shih-Ting LIN, Szu-Wei LU
  • Patent number: 11948896
    Abstract: A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate via structure is formed over a substrate. The first stacked die package structure is over the through substrate via structure, wherein the first stacked die package structure comprises a plurality of memory dies. The underfill layer is over the first stacked die package structure. the package layer is over the underfill layer, wherein the package layer has a protruding portion that extends below a top surface of the through substrate via structure.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu
  • Publication number: 20230053541
    Abstract: The invention provides a two-sided auxiliary structure for induction cards, which comprises: a metal shield layer; and two high-conductivity magnetic layers, which are respectively set on two opposite sides of the metal shield layer, wherein the area of the metal shield layer is greater than those of the two high-conductivity magnetic layers. The two-sided auxiliary structure for induction cards of the invention improves the problem of poor induction success rate of plural induction cards.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 23, 2023
    Inventors: MING-HONG YEH, CHUNG-PING LAI, WAN-CHI CHANG, KUNG-TING TSAI
  • Publication number: 20180014211
    Abstract: The present invention relates to wireless networks and more specifically to systems and methods for selecting and implementing communication parameters used in a wireless network to optimize communication between access points and client devices while accounting for effects of adjacent networks. In one embodiment, the present invention includes a Wi-Fi coordinator device that receives packet information from devices within wireless range of the Wi-Fi coordinator. The Wi-Fi coordinator sends the packet information to a cloud intelligence engine which then time shifts the packet information and combines the packet information with other packet information. Using this integrated packet information, the cloud intelligence devices determines the access point settings to improve the operation of the network.
    Type: Application
    Filed: September 21, 2017
    Publication date: January 11, 2018
    Inventors: Terry F K Ngo, Seung Baek Yi, Erick Kurniawan, Kung Ting Tsai