Patents by Inventor Kun-Han Hsieh
Kun-Han Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11852679Abstract: A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.Type: GrantFiled: April 14, 2022Date of Patent: December 26, 2023Assignee: MPI CORPORATIONInventors: Shih-Ching Chen, Jun-Liang Lai, Shung-Bo Lin, Ta-Cheng Liao, Yu-Chih Hsiao, Kun-Han Hsieh
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Publication number: 20210109443Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) a filler selected from one or more of alumina, graphene, inorganic clay, silica, and zinc oxide and having a particle diameter ranging from 10 nm to 1.0 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.Type: ApplicationFiled: January 23, 2019Publication date: April 15, 2021Applicant: MICROCOSM TECHNOLOGY CO., LTD.Inventors: Tang Chieh Huang, Chau Chin Chuang, Yu Chiao Shih, Kun Han Hsieh
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Publication number: 20210088903Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) titanium dioxide having a particle size of 0.2 ?m to 10 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.Type: ApplicationFiled: January 23, 2019Publication date: March 25, 2021Applicant: MICROCOSM TECHNOLOGY CO., LTD.Inventors: Tang Chieh Huang, Chau Chin Chuang, Yu Chiao Shih, Kun Han Hsieh
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Patent number: 9643271Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.Type: GrantFiled: January 20, 2015Date of Patent: May 9, 2017Assignee: MPI CorporationInventors: Kun-Han Hsieh, Huo-Kang Hsu, Kuan-Chun Chou, Tsung-Yi Chen, Chung-Tse Lee
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Publication number: 20150206850Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.Type: ApplicationFiled: January 20, 2015Publication date: July 23, 2015Inventors: Kun-Han HSIEH, Huo-Kang HSU, Kuan-Chun CHOU, Tsung-Yi CHEN, Chung-Tse LEE
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Patent number: 7635199Abstract: The present invention is related to an illumination device capable of producing ambient light and whose structure can be efficiently manufactured and assembled. The illumination device comprises: a substrate electrically connect to a power supply, a plurality of light sources attached to a surface of the substrate, a reflection body with a reflection surface situated a distance from said plurality of light sources, a shell having a diffusion surface situated a distance from said reflection surface. The illumination device may further comprise a housing for receiving and supporting the substrate and the reflection body. The housing is configured to join with the shell and can be further attached to an external device receiving the ambient light. The light emitted from the light sources is reflected by the reflection body to the diffusion member and then radiates outwardly to the surrounding environment of the shell. The reflection surface of the reflection body is inclined at angle relative to the substrate.Type: GrantFiled: March 1, 2007Date of Patent: December 22, 2009Assignee: UPEC Electronics Corp.Inventors: Huang-Chen Guo, Chen-Yuan Huang, Chen-Ming Wang, Tzy-Chang Tan, Kun-Han Hsieh, Kai-Chi Chang
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Publication number: 20070147048Abstract: The present invention is related to an illumination device capable of producing ambient light and whose structure can be efficiently manufactured and assembled. The illumination device comprises: a substrate electrically connect to a power supply, a plurality of light sources attached to a surface of the substrate, a reflection body with a reflection surface situated a distance from said plurality of light sources, a shell having a diffusion surface situated a distance from said reflection surface. The illumination device may further comprise a housing for receiving and supporting the substrate and the reflection body. The housing is configured to join with the shell and can be further attached to an external device receiving the ambient light. The light emitted from the light sources is reflected by the reflection body to the diffusion member and then radiates outwardly to the surrounding environment of the shell. The reflection surface of the reflection body is inclined at angle relative to the substrate.Type: ApplicationFiled: March 1, 2007Publication date: June 28, 2007Inventors: Huang-Chen Guo, Chen-Yuan Huang, Chen-Ming Wang, Tzy-Chang Tan, Kun-Han Hsieh, Kai-Chi Chang
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Publication number: 20070133212Abstract: An illuminating device equipped with an integrated one-piece transparent shell is provided according to one embodiment of the invention. The illuminating device may be connected to a television, a computer monitor or an audio apparatus such that the illuminating device projects ambient light onto background walls or surroundings in order to improve the comfort and viewing experience. In one embodiment of the invention, an illuminating device used for ambient light comprises: a circuit unit comprising a plurality of light sources emitting light and a transceiver accepting display information; a shell coupled with said circuit unit; wherein a portion of said shell is transparent; wherein the shell comprises a diffusion portion and a reflection portion, and wherein a portion of said emitted light is reflected by said reflection portion and dispersed by said diffusion portion.Type: ApplicationFiled: February 17, 2006Publication date: June 14, 2007Inventors: Wan-Chun Lin, Tzy-Chang Tan, Kun-Han Hsieh, Kai-Chi Chang