Patents by Inventor Kunho Song

Kunho Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for laminating a tape film on a substrate and a system of fabricating a semiconductor device using the same
    Patent number: 10418259
    Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngmin Kim, JaeYong Park, Kunho Song, Byung-Joo Jo
  • Chuck table and substrate processing system including the same
    Patent number: 10211084
    Abstract: A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: February 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doojin Kim, Youngsik Kim, Kunho Song, Yongdae Ha
  • APPARATUS FOR LAMINATING A TAPE FILM ON A SUBSTRATE AND A SYSTEM OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20170133249
    Abstract: A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.
    Type: Application
    Filed: October 27, 2016
    Publication date: May 11, 2017
    Inventors: YOUNGMIN KIM, JaeYong PARK, KUNHO SONG, Byung-Joo JO
  • CHUCK TABLE AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
    Publication number: 20170040202
    Abstract: A chuck table is provided and a substrate processing system including the same. The chuck table includes a base disk having a first vacuum hole, and a chuck disk disposed on the first vacuum hole. The chuck disk includes a plurality of first sectors and a first connection member connecting the first sectors to each other.
    Type: Application
    Filed: July 20, 2016
    Publication date: February 9, 2017
    Inventors: DOOJIN KIM, YOUNGSIK KIM, KUNHO SONG, YONGDAE HA
  • Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
    Patent number: 7989939
    Abstract: Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: August 2, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Ik Hwang, YongJin Jung, Kunho Song
  • SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SAME
    Publication number: 20100052130
    Abstract: Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Inventors: HYUN-IK HWANG, YONG-JIN JUNG, KUNHO SONG