Abstract: Provided are an infrared absorber having extremely low reflectivity in the wavelength band of infrared rays, a method for manufacturing the same, a black-body radiation device, and a radiative cooling device. Provided is an infrared absorber 10 provided with: an absorption layer 11 comprising carbon black and a resin; and, on the absorption layer 11, a surface layer 12 that comprises a resin including essentially no pigment and that has an optical confinement structure 13 in which a plurality of minute projections are formed on the surface thereof, the hemispherical total reflectivity of the infrared absorber 10 in infrared wavelengths of 5-15 ?m being 0.2% or less. Further provided are a method for manufacturing the infrared absorber, a black-body radiation device, and a radiative cooling device.

Abstract: This light absorber 10 comprises a light absorbing layer 11 made of a resin which contains a light absorbing material. The light absorber is obtained by forming an optical confinement structure 12 in which a plurality of fine protrusions are formed on a surface 11a of the light absorber. The light absorber is configured such that luminous reflectance RSCI according to the Specular Components Included (SCI) method, which detects a total of specular reflected light and diffuse reflected light, does not exceed 0.20%.

Abstract: This method for manufacturing a light absorber includes: a first step for irradiating a resin substrate with ion beams; a second step for etching the irradiated resin substrate with an alkaline solution to form an uneven surface on the surface thereof; a third step for forming a transfer body which covers the uneven surface of the etched resin substrate; and a fourth step for peeling off the transfer body from the resin substrate to obtain a light absorber. A metal film, a photocurable resin, and a silicone rubber are disclosed as an example of the transfer body.

Abstract: This method for manufacturing a light absorber includes: a first step for irradiating a resin substrate with ion beams; a second step for etching the irradiated resin substrate with an alkaline solution to form an uneven surface on the surface thereof; a third step for forming a transfer body which covers the uneven surface of the etched resin substrate; and a fourth step for peeling off the transfer body from the resin substrate to obtain a light absorber. A metal film, a photocurable resin, and a silicone rubber are disclosed as an example of the transfer body.