Abstract: A polyetherketone resin composition comprising 5-100 parts by weight of a carbon fiber having an average fiber diameter of 5-20 .mu.m and an average fiber length of 30-500 .mu.m per 100 parts by weight of a composition comprising 95-50% by weight of a polyetherketone and 5-50% by weight of a liquid crystal polyester, and a carrier for processing or treating a semi-conductor wafer molded from the above polyetherketone resin composition. Said composition is excellent in molding properties and said carrier is excellent in stiffness, dimensional stability and antistatic properties.The above liquid crystal polyester includes, for example, those consisting of repeating structural units (I), (II), (III) and (IV), shown below, in a molar ratio (II)/(I) of 0.2-1.0, a molar ratio ?(III)+(IV)!/(II) of 0.9-1.1 and a molar ratio (IV)/(III) of 0-1.0.

Abstract: A liquid crystal polyester resin composition comprising (a) a liquid crystal polyester, (b) an aluminum powders, flakes and/or fibers, and if necessary (c) titanium oxide and/or talc, has high heat resistance and a small thermal storage even when exposed to high temperatures, and thus is useful for producing a lamp reflector hardly deformed by heat from a halogen lamp, etc.

Abstract: Stripping fingers for use in a copying machine, molded of a liquid crystal polyester resin composition made up of a liquid crystal polyester having a flow temperature of 340.degree. C. or higher and titanium oxide whiskers. The stripping fingers have excellent heat deflection resistance, heat aging resistance, thermal shock resistance, heat load resistance, low attack on the counter roller, good shape retainability of the finger edges, and good non-stick property against toner. Coating with PFA at 330.degree. C. or higher on the stripping finger increases non-tackiness.

Abstract: The present invention provides a process for producing a carboxylic acid phenyl ester having such a high purity that is required in various fields.A process for producing a highly pure carboxylic acid phenyl ester by reacting an aromatic hydroxy compound with a carboxylic acid anhydride, characterized by conducting the reaction in the presence of 0.01 part by weight or more of a tertiary amine per 100 parts by weight of the aromatic hydroxy compound.

Abstract: The present invention provides an aromatic oligomer comprising repeating structural units represented by the following formula (I), which oligomer has a number-average degree of polymerization of 2 to 10 and a flow temperature of 100.degree. to 400.degree. C.; and a process for preparing the same: ##STR1## wherein X is selected from O and S; and Ar is selected from ##STR2## wherein R.sup.1 and R.sup.2 are each selected from alkyl group having 1 to 3 carbon atoms and phenyl group, and p and q are each an integer of 0 to 2.The aromatic oligomer of this invention is mixed or reacted with a polymeric substance such as thermoplastic resin, thermosetting resin and rubber to realize enhancement of performance and functional characteristics of the polymeric material.

Abstract: There are provided a liquid crystal polyester resin composition comprising 100 parts by weight of a liquid crystal polyester, 45 to 80 parts by weight of graphite having an average particle size of 5 .mu.m or more and 0 to 140 parts by weight of talc having an average particle size of 5 .mu.m or more, the total amount of the graphite and the talc being 55 to 185 parts by weight. There are provided a molded article such as a carrier for electronic part, a heat-resistant tray for IC, or the like, which has high heat resistance in soldering, only slight anisotropy and warpage, a surface resistivity of 1.times.10.sup.4 to 1.times.10.sup.8 .OMEGA., and an initial voltage due to electrification and a half-life (a time required for the initial voltage due to electrification to be reduced to one-half) which are controlled to be further reduced; and a liquid crystal polyester resin composition excellent in moldability which gives said molded article.

Abstract: An aromatic polyester superior in heat resistance and mechanical properties and satisfactory in lightness and color tone is provided. The aromatic polyester has resorcinol structure, has the formula (1), ##STR1## wherein R is halogen, C.sub.1 -C.sub.5 alkyl, or phenyl; m is an integer of 0 to 2, and when m is 2, the two substituents represented by R may be different from each other; and gives a powder fraction having a lightness (L value) of 70 or more and a red degree (a value) of 5 or less, which powder fraction is obtained by pulverizing the heat-resistant aromatic polyester, sieving the pulverized polyester by Tyler standard sieves and being allowed to pass through 60-mesh sieve but not 325-mesh sieve.

Abstract: Stripping fingers for use in a copying machine, molded of a liquid crystal polyester resin composition containing a liquid crystal polyester having a flow temperature of 340.degree. C. or higher and aluminum borate whiskers. The stripping fingers have excellent heat deflection resistance, heat aging resistance, thermal shock resistance, heat load resistance, low attack on the counter roller, good shape retainability of the finger edges, and good non-stick property against toner. Coating with PFA at 330.degree. C. or higher on the stripping finger increases non-tackiness.

Abstract: A liquid crystal polyester resin composition improved in fluidity which comprises 100 parts by weight of liquid crystal polyester and 0.5-10 parts by weight of an oligomer comprising a repeating structural unit of the formula ##STR1## as the main component and having a flow temperature determined by a specified method which is in the range of 160.degree.-350.degree. C. and is at least 20.degree. C. lower than the flow temperature of the liquid crystal polyester to be combined therewith.

Abstract: A wholly aromatic polyester resin composition contains:(1) a wholly aromatic polyester resin,(2) at least one member selected from a glass fiber and a silica-alumina fiber,(3) glass beads,(4) titanium oxide, and(5) a fluorocarbon polymerThe wholly aromatic polyester resin composition has high heat resistance and mechanical strengths, low anisotropy and excellent appearance, and shows low dissolution of components, excellent releasability and non-tackiness. It can be molded into an ovenware.

Abstract: The aromatic polysulfone resin composition of the present invention can be produced by mixing 100 parts by weight of an aromatic polysulfone resin and 0.1 to 5 parts by weight of a hydrotalcites and/or a zeolite. Molded articles formed of said composition have a mechanical strength and heat resistance inherent to its constituent resin, and generate low-boiling gases and corrosive gases very little. Therefore, the composition of the present invention is best suited for relay parts.

Abstract: An aromatic polysulfone resin composition improved in dispersibility of fluorocarbon polymer comprising 0.3 to 50 parts by weight of a low molecular weight fluorocarbon polymer fluorinated up to its molecular end, having a flow temperature of 350.degree. C. or lower as measured by the following method, and 100 parts by weight of an aromatic polysulfone resin:Flow temperature: A temperature at which melt viscosity reaches 48,000 poises when a molten sample is extruded from a nozzle (1 mm in inner diameter and 10 mm in length) of a capillary rheometer under a load of 100 kg/cm.sup.2 at a temperature elevation speed of 4.degree. C./minute.

Abstract: An aromatic polysulfone resin composition comprising 100 parts by weight of an aromatic polysulfone resin, 3 to 15 parts by weight of an electro-conductive carbon black having a dibutyl phthalate absorption of 150 ml/100 g or more and 0.1 to 2.5 parts by weight of a fluorocarbon-type surface active agent. The aromatic polyslfone resin composition has surface resistivity in a range of 10.sup.7 to 10.sup.13 .OMEGA., remarkably lowered initial charged voltage and half-life period, and excellent thermal stability and dimensional accuracy, so that it is suitable for use as a material for electronic parts, office automation equipment parts and audiovisual equipment parts.

Abstract: A liquid-crystal polyester resin composition comprising 30 to 95 wt. % of a liquid-crystal polyester and 70 to 5 wt. % of an aluminum borate whisker. The present invention relates to an improvement in the largest defects of a liquid-crystal polyester, i.e. a large anisotropy and a low weld strength, and the liquid-crystal polyester resin composition of the present invention is useful in producing small-sized parts, parts with thin-wall portions and precision parts having a complicated form.

Abstract: The wholly aromatic polyester resin composition of the present invention comprises a wholly aromatic polyester resin, at least one fibrous reinforcing agent, glass beads and titanium oxide.The composition of the present invention has high heat resistance and mechanical strengths, low anisotropy and excellent appearance, being safe and shows a low dissolution amount in an extraction test according to No. 20 of the Welfare Ministry. Accordingly, the vessel obtained by molding the composition is suitable for use as an ovenware.

Abstract: A process for producing an aromatic polysulfone molding compound improved in mold-release characteristics by adding a predetermined amount of metal soap to aromatic polysulfone resin, wherein pellets composed of an aromatic polysulfone resin and a specific amount of metal soap, and otherwise similar pellets but containing no metal soap are prepared separately by melt-mixing, and these two kinds of pellets are dry-blended together so as to satisfy a predetermined condition.

Abstract: A resin composition which comprises(A) 60 to 99% by weight of a composition comprising 1 to 99% by weight of a polyarylene ester and 99 to 1% by weight of a polycarbonate or a polyalkylene terephthalate, and(B) 40 to 1% by weight of an ethylene copolymer consisting of 50 to 90% by weight of ethylene, 5 to 49% by weight of an .alpha..beta.-unsaturated carboxylic acid alkyl ester and 0.5 to 10% by weight of maleic anhydride,said resin composition having significantly improved impact properties with less dependency on the radius of notched part without deteriorating the excellent heat distortion resistance or excellent processability, barrier properties, chemical resistance, heat resistance of (A) of the composition comprising a polyarylene ester and a polycarbonate or a polyalkylene terephthalate and being useful for utilities such as parts for electric and/or electronic equipment, parts of automobiles and parts of office automation equipment which have been desired to be miniaturized and to have a thin-wall.

Abstract: A resin composition for printed circuit board comprising:(A) 30-90% by weight of a liquid crystal polyester,(B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 .mu.m or below and an average length of 200 .mu.m or below, and(C) 3-30% by weight of an alkaline earth metal carbonate.

Abstract: A wire coating resin composition comprising 25 to 95% by weight of a polyetherketone and 75 to 5% by weight of an aromatic polysulfone, which is characterized by the intrinsic viscosity (y) of the polyetherketone complying with the condition0.83.ltoreq.y.ltoreq.0.01x+0.65,wherein x represents weight percentage of the polyetherketone in the wire coating resin composition.

Abstract: An aromatic polysulfone resin composition with excellent plating characteristics comprising:(A) 50 to 90% by weight of an aromatic polysulfone,(B) 3 to 40% by weight of wollastonite of which 90% by weight or more of the total amount have a particle size smaller than 300 meshes, and(C) 3 to 30% by weight of an alkaline earth metal carbonate is disclosed.This aromatic polysulfone resin composition has excellent mechanical properties, thermal properties (in terms of thermal deformation temperature and linear thermal expansion coefficient), dimensional stability, thermal stability during processing and surface smoothness and also shows excellent plating characteristics in a wide range of plating conditions (etching conditions). By using this aromatic polysulfone resin composition, it is possible to easily obtain a printed circuit board having a desired configuration by means of injection molding, and it becomes possible to form the circuits with a fine line width.