Patents by Inventor Kuniaki Kimoto

Kuniaki Kimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solar cell lead, method of manufacturing the same, and solar cell using the same
    Patent number: 8653380
    Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 18, 2014
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Ken Takahashi, Hiromitsu Kuroda, Hiroshi Okikawa, Kuniaki Kimoto, Hiroyuki Akutsu, Yukio Ito, Iku Higashidani
  • Solar cell lead, method of manufacturing the same, and solar cell using the same
    Publication number: 20100218981
    Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 2, 2010
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Ken Takahashi, Hiromitsu Kuroda, Hiroshi Okikawa, Kuniaki Kimoto, Hiroyuki Akutsu, Yukio Ito, Iku Higashidani