Abstract: A polyphenylene sulfide resin composition including a polyphenylene sulfide resin having a specific amount of oligomers and a specific amount of a functional group, an amorphous thermoplastic resin having a glass transition temperature (Tg) of 120° C. or higher, and an additive having a specific amount of a functional group. The moldings obtained from this polyphenylene sulfide resin composition have a good toughness (impact strength) and weld strength. The use of this polyphenylene sulfide resin composition as a material for secondary battery cases makes it possible to maintain the initial electrolytic performance over a long period of time.

Abstract: A polyphenylene sulfide resin composition including a polyphenylene sulfide resin having a specific amount of oligomers and a specific amount of a functional group, an amorphous thermoplastic resin having a glass transition temperature (Tg) of 120° C. or higher, and an additive having a specific amount of a functional group. The moldings obtained from this polyphenylene sulfide resin composition have a good toughness (impact strength) and weld strength. The use of this polyphenylene sulfide resin composition as a material for secondary battery cases makes it possible to maintain the initial electrolytic performance over a long period of time.

Abstract: A photoresin printing plate having a Shore A hardness at 20.degree. C. of 25 to 60, an impact resilience at 20.degree. C. of 35% or more as measured by a falling ball method and a surface tack at 20.degree. C. of 40 g/cm or less has been found not only to be capable of providing prints having an image of high precision but also to be capable of releasing the paper dust or the like, which has adhered to the printing plate, in a short period of time during the printing operation, so that it did not become necessary to interrupt the printing operation in order to clean the printing plate, which leads to an efficient production of the prints.

Abstract: A photosensitive resin composition which is improved with respect to surface tack-free characteristic after curing by exposure to actinic radiation is disclosed. Further, there is disclosed a method of preparing a surface-tack free photocured pattern structure using the photosensitive resin composition, which enables pattern structures improved with respect to surface tack-free characteristic to be obtained in a shortened period of time.