Abstract: In a ceramic electronic component, a first internal electrode includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section is connected to a first external electrode. The number of cross-linked sections per unit area in the first extraction section is less than the number of cross-linked sections per unit area in the first opposed section.

Abstract: A ceramic electronic component includes a first internal electrode that includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section includes a first thick section. The first thick section is thicker than a first central section of the first opposed section. The first opposed section includes a first base end section opposed to a second tip section of the second internal electrode closer to the first end surface, with the ceramic layer interposed therebetween, and the first base end section includes a first thin section. The first thin section is thinner than the first central section.

Abstract: In a ceramic electronic component, a section of a first extraction section located closer to a first end surface defines a first thick section. The first thick section is at least about 1.5 times as thick as a first central section of a first opposed section in a direction. The length of the first thick section is within the range of about ¼ to about ¾ of a distance from a tip of a second opposed section closer to the first end surface, to the first end surface in the direction.

Abstract: A method includes: a laminate block preparing step of preparing a laminate block as an assembly of a number of laminates, by alternately laminating magnetic layers containing, as their main constituent, a magnetic metal material containing a glass material and conductor layers containing a conductive material so that the conductor layers are electrically connected to each other to form a coil pattern; a dividing step of dividing the laminate block by cutting the laminate block for each of the laminates; a magnetic material applying step of applying a magnetic material containing the magnetic metal material to side surfaces of the laminates; and a firing step of firing the laminates with the magnetic material applied thereto, thereby preparing a component body. This achieves a method for manufacturing a laminated coil component preferred for a power inductor with improved reliability, without impairing direct-current superimposition characteristics.

Abstract: In a ceramic electronic component, a section of a first extraction section located closer to a first end surface defines a first thick section. The first thick section is at least about 1.5 times as thick as a first central section of a first opposed section in a direction. The length of the first thick section is within the range of about ¼ to about ¾ of a distance from a tip of a second opposed section closer to the first end surface, to the first end surface in the direction.

Abstract: In a ceramic electronic component, a first internal electrode includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section is connected to a first external electrode. The number of cross-linked sections per unit area in the first extraction section is less than the number of cross-linked sections per unit area in the first opposed section.

Abstract: A ceramic electronic component includes a first internal electrode that includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section includes a first thick section. The first thick section is thicker than a first central section of the first opposed section. The first opposed section includes a first base end section opposed to a second tip section of the second internal electrode closer to the first end surface, with the ceramic layer interposed therebetween, and the first base end section includes a first thin section. The first thin section is thinner than the first central section.

Abstract: A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.

Abstract: A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.

Abstract: A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

Abstract: A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.

Abstract: A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

Abstract: Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

Abstract: Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

Abstract: A ceramic electronic part includes a ceramic assemblage containing laminated plural ceramic sheets, plural inner electrodes formed between the ceramic sheets and containing Ni as a major component, and outer electrodes electrically connected to the inner electrodes. The outer electrodes contain Ag as a major component and Au and an inorganic oxide as minor components.

Abstract: A ceramic electronic component includes a ceramic body; terminal electrodes formed on the ceramic body; and lead terminals joined to the terminal electrodes with solder containing Sn. Each terminal electrode includes a first electrode layer formed on the ceramic body and a second electrode layer formed on the first electrode layer. The second electrode layer contains a conductive constituent containing at least Zn, Ag and/or Cu, and Sn. The Zn content in the second electrode layer is about 4% by weight or more in relation to 100% by weight of the conductive constituent and is within the solubility limit not forming AgZn and/or CuZn intermetallic compounds.

Abstract: An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90° or less as measured in a nitrogen atmosphere.

Abstract: A ceramic electronic part includes a ceramic assemblage containing laminated plural ceramic sheets, plural inner electrodes formed between the ceramic sheets and containing Ni as a major component, and outer electrodes electrically connected to the inner electrodes. The outer electrodes contain Ag as a major component and Au and an inorganic oxide as minor components.

Abstract: A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.

Abstract: A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.