Patents by Inventor Kunihiko Hatsushika

Kunihiko Hatsushika has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
    Patent number: 8456186
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: June 4, 2013
    Assignees: Tokyo Electron Limited, Ibiden Co., Ltd.
    Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
  • RELIABILITY EVALUATION TEST APPARATUS, RELIABILITY EVALUATION TEST SYSTEM, CONTACTOR, AND RELIABILITY EVALUATION TEST METHOD
    Publication number: 20080018355
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Application
    Filed: June 27, 2007
    Publication date: January 24, 2008
    Inventors: Kiyoshi TAKEKOSHI, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
  • Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
    Patent number: 7242206
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: July 10, 2007
    Assignees: Tokyo Electron Limited, Kabushiki Kaisha Toshiba, Ibiden Co., Ltd.
    Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
  • Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
    Patent number: 7091733
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: August 15, 2006
    Assignees: Tokyo Electron Limited, Kabushiki Kaisha Toshiba, Ibiden Co., Ltd.
    Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
  • Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
    Publication number: 20050253575
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Application
    Filed: July 13, 2005
    Publication date: November 17, 2005
    Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido
  • Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
    Publication number: 20040183561
    Abstract: A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
    Type: Application
    Filed: March 31, 2004
    Publication date: September 23, 2004
    Inventors: Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui, Hisashi Kaneko, Nobuo Hayasaka, Yoshiyuki Ido