Abstract: A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

Abstract: A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y<162 is satisfied, and the thermoplastic resin includes a hydride of a styrene-based A-B-A type triblock body. (wherein R1, R2, R4 and R6 represent organic groups including an alkyl group, an aryl group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; R3 and R5 represent organic groups including an alkyl group, an aryl group, an alkoxy group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; and M represents a trivalent metal atom.

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.

Abstract: A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M—Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Abstract: A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/?-olefin copolymer and an ethylene/?-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.

Abstract: Provided are an element sealing resin composition for organic electronic devices, which promotes a balance between the water vapor barrier properties and adhesiveness, decreases the water content, and sufficiently suppresses the generation of outgases, so that consequently the service life of an element for organic electronic devices can be lengthened, and which gives a satisfactory external appearance when used to seal an organic electronic device; an element sealing resin sheet for organic electronic devices; an organic electroluminescent element; and an image display apparatus. Disclosed is an element sealing resin composition for organic electronic devices, comprising a polyisobutylene resin (A) having a weight average molecular weight (Mw) of 10,000 to 300,000 and a hydrogenated cyclic olefin-based polymer (B), and having a water content according to the Karl-Fischer method of 500 ppm or less and an amount of outgas generation of 500 ppm or less when heated at 85° C. for 1 hour.

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices and other things, which have excellent long-term reliability and excellent visibility by capturing not only the moisture on the front surface or lateral surfaces of the resin composition for element encapsulation for organic electronic devices, but also the moisture permeating through the interior of the resin composition for element encapsulation for organic electronic devices. The resin composition includes a polyisobutylene resin (A) containing a polyisobutylene skeleton in a main chain or in a side chain and having a weight average molecular weight (Mw) of 300,000 or more; and a tackifying agent (B) as main components, includes an organometallic compound (C) having hygroscopic properties, and has a water content of 1000 ppm or less.

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Abstract: A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y<162 is satisfied, and the thermoplastic resin includes a hydride of a styrene-based A-B-A type triblock body. (wherein R1, R2, R4 and R6 represent organic groups including an alkyl group, an aryl group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; R3 and R5 represent organic groups including an alkyl group, an aryl group, an alkoxy group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; and M represents a trivalent metal atom.

Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value except the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.

Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.