Abstract: A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 ?m, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 ?m, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).

Abstract: A microcapsule-type curable resin composition enables the mass production of microcapsules each encapsulating a curing agent and therefore can be produced at significantly low cost, and which has an excellent adhesion property and excellent storage stability. Particularly, a microcapsule-type curable resin composition can exhibit excellent low-temperature curability and an excellent curing rate when used for a screw member such as a screw and can exhibit a significantly superior effect when used for preventing the looseness of screws. A microcapsule-type curable resin composition includes microcapsules each encapsulating (a) a compound having at least three thiol groups; (b) a substance capable of being cured by reacting with the compound having at least three thiol groups; and (c) a binder capable of adhering the microcapsules to a material of interest. The curable resin composition can be used preferably for the adhesion of a screw member.

Abstract: Embodiments of the invention provide a polymerizable sealing composition is an aqueous composition that has a low impact on the usage environment, exhibits excellent screwing-sealing properties, produces only a small amount of chip and the like during screwing, and ensures good usability. According to at least one embodiment, the polymerizable sealing composition includes: (1) microcapsules that include a component (a) and a component (b), the component (a) being a compound that has a bisphenol skeleton, and comprises one or more (meth)acrylic groups in its molecule, and the component (b) being a (meth)acrylic monomer that has a molecular weight within a specific range, and has a specific chemical structure; (2) a binder component that has a specific structure; (3) an element that cures the component (a) and the component (b); and (4) water, in a specific compositional ratio, respectively.

Abstract: A microcapsule-type curable resin composition enables the mass production of microcapsules each encapsulating a curing agent and therefore can be produced at significantly low cost, and which has an excellent adhesion property and excellent storage stability. Particularly, a microcapsule-type curable resin composition can exhibit excellent low-temperature curability and an excellent curing rate when used for a screw member such as a screw and can exhibit a significantly superior effect when used for preventing the looseness of screws. A microcapsule-type curable resin composition includes microcapsules each encapsulating (a) a compound having at least three thiol groups; (b) a substance capable of being cured by reacting with the compound having at least three thiol groups; and (c) a binder capable of adhering the microcapsules to a material of interest. The curable resin composition can be used preferably for the adhesion of a screw member.

Abstract: A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 ?m, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 ?m, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).