Patents by Inventor Kunihiko Minegishi
Kunihiko Minegishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11765832Abstract: A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.Type: GrantFiled: September 25, 2019Date of Patent: September 19, 2023Assignee: Canon Kabushiki KaishaInventors: Mitsutoshi Hasegawa, Kunihiko Minegishi
-
Patent number: 11382209Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.Type: GrantFiled: April 30, 2019Date of Patent: July 5, 2022Assignee: CANON KABUSHIKI KAISHAInventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Shingo Ishiguri
-
Patent number: 11342259Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: GrantFiled: November 2, 2020Date of Patent: May 24, 2022Assignee: CANON KABUSHIKI KAISHAInventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
-
Patent number: 11211322Abstract: A plurality of lands is formed apart from each other on a surface of a package substrate. Another plurality of lands is formed apart from each other on a surface of a printed wiring board. The surface of the package substrate and the surface of the printed wiring board face each other. The plurality of lands and another plurality of lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at the corresponding land. A ratio of a solder bonded area of at least each of lands, among another plurality of the lands, of which distance value to a corresponding one of the lands is larger than an average distance value between the lands and another lands, to a solder bonded area of the corresponding one of the lands is 56% or more and 81% or less.Type: GrantFiled: July 25, 2019Date of Patent: December 28, 2021Assignee: Canon Kabushiki KaishaInventor: Kunihiko Minegishi
-
Patent number: 10980160Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.Type: GrantFiled: September 23, 2019Date of Patent: April 13, 2021Assignee: Canon Kabushiki KaishaInventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Yoshitomo Fujisawa, Shingo Ishiguri
-
Publication number: 20210074626Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: ApplicationFiled: November 2, 2020Publication date: March 11, 2021Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
-
Patent number: 10861785Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: GrantFiled: May 30, 2019Date of Patent: December 8, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
-
Publication number: 20200113056Abstract: A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.Type: ApplicationFiled: September 25, 2019Publication date: April 9, 2020Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi
-
Publication number: 20200100408Abstract: An image pickup module includes a printed wiring board, an electronic component, solder, and a thermosetting resin. The printed wiring board has a first surface provided with first lands. The electronic component includes an image pickup element and has a second surface provided with second lands. The thermosetting resin is in contact with the solder and bonds the printed wiring board to the electronic component. The solder bonds the first lands to the second lands and has a hollow portion. The area of the hollow portion is 5% to 50% of the total area of the solder as observed from the electronic component side in a transmission mode using an X-ray.Type: ApplicationFiled: September 23, 2019Publication date: March 26, 2020Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Yoshitomo Fujisawa, Shingo Ishiguri
-
Publication number: 20190385940Abstract: An electronic module includes an electronic part including a bottom surface and lands, the bottom surface including a first region and a third region surrounding the first region, the first lands being disposed in the third region, a printed wiring board including a main surface and second lands, the main surface including a second region and a fourth region surrounding the second region, the main surface facing the bottom surface of the electronic part, the second lands being disposed in the fourth region, solder bonding portions respectively bonding the first lands to the second lands, and a resin portion containing a cured product of a thermosetting resin and being in contact with the solder boding portions. A recess portion is provided in the second region. The resin portion is not provided in the recess portion.Type: ApplicationFiled: May 30, 2019Publication date: December 19, 2019Inventors: Shingo Ishiguri, Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki
-
Publication number: 20190348359Abstract: A plurality of lands is formed apart from each other on a surface of a package substrate. Another plurality of lands is formed apart from each other on a surface of a printed wiring board. The surface of the package substrate and the surface of the printed wiring board face each other. The plurality of lands and another plurality of lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at the corresponding land. A ratio of a solder bonded area of at least each of lands, among another plurality of the lands, of which distance value to a corresponding one of the lands is larger than an average distance value between the lands and another lands, to a solder bonded area of the corresponding one of the lands is 56% or more and 81% or less.Type: ApplicationFiled: July 25, 2019Publication date: November 14, 2019Inventor: Kunihiko Minegishi
-
Publication number: 20190342991Abstract: A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion.Type: ApplicationFiled: April 30, 2019Publication date: November 7, 2019Inventors: Mitsutoshi Hasegawa, Kunihiko Minegishi, Takashi Sakaki, Shingo Ishiguri
-
Patent number: 10403571Abstract: A plurality of lands is formed apart from each other on a surface of a package substrate. Another plurality of lands is formed apart from each other on a surface of a printed wiring board. The surface of the package substrate and the surface of the printed wiring board face each other. The plurality of lands and another plurality of lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at the corresponding land. A ratio of a solder bonded area of at least each of lands, among another plurality of the lands, of which distance value to a corresponding one of the lands is larger than an average distance value between the lands and another lands, to a solder bonded area of the corresponding one of the lands is 56% or more and 81% or less.Type: GrantFiled: March 12, 2018Date of Patent: September 3, 2019Assignee: CANON KABUSHIKI KAISHAInventor: Kunihiko Minegishi
-
Patent number: 10398037Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.Type: GrantFiled: February 15, 2018Date of Patent: August 27, 2019Assignee: CANON KABUSHIKI KAISHAInventors: Kunihiko Minegishi, Mitsutoshi Hasegawa, Takashi Sakaki
-
Patent number: 10076037Abstract: Provided is a printed circuit board including: an electronic component having a bottom face and a side face, in which first lands are provided on the bottom face; a printed wiring board having a mounting face, in which second lands corresponding to the first lands are provided on the mounting face, and in which the electronic component is mounted such that the bottom face faces the mounting face; a solder aggregation member provided outside the second lands on the mounting face; pieces of first solder each of which joins each of the first lands to corresponding one of the second lands; second solder formed on the solder aggregation member; and a thermosetting resin adhered to the bottom face of the electronic component outside the first lands and to the mounting face of the printed wiring board outside the second lands.Type: GrantFiled: August 28, 2017Date of Patent: September 11, 2018Assignee: CANON KABUSHIKI KAISHAInventor: Kunihiko Minegishi
-
Publication number: 20180242462Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.Type: ApplicationFiled: February 15, 2018Publication date: August 23, 2018Inventors: Kunihiko Minegishi, Mitsutoshi Hasegawa, Takashi Sakaki
-
Publication number: 20180204793Abstract: A plurality of lands is formed apart from each other on a surface of a package substrate. Another plurality of lands is formed apart from each other on a surface of a printed wiring board. The surface of the package substrate and the surface of the printed wiring board face each other. The plurality of lands and another plurality of lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at the corresponding land. A ratio of a solder bonded area of at least each of lands, among another plurality of the lands, of which distance value to a corresponding one of the lands is larger than an average distance value between the lands and another lands, to a solder bonded area of the corresponding one of the lands is 56% or more and 81% or less.Type: ApplicationFiled: March 12, 2018Publication date: July 19, 2018Inventor: Kunihiko Minegishi
-
Patent number: 9960109Abstract: A plurality of lands is formed apart from each other on a surface of a package substrate. Another plurality of lands is formed apart from each other on a surface of a printed wiring board. The surface of the package substrate and the surface of the printed wiring board face each other. The plurality of lands and another plurality of lands are bonded to each other with solder having a height of 30% or less of a diameter of a solder bonding portion at the corresponding land. A ratio of a solder bonded area of at least each of lands, among another plurality of the lands, of which distance value to a corresponding one of the lands is larger than an average distance value between the lands and another lands, to a solder bonded area of the corresponding one of the lands is 56% or more and 81% or less.Type: GrantFiled: October 27, 2015Date of Patent: May 1, 2018Assignee: Canon Kabushiki KaishaInventor: Kunihiko Minegishi
-
Publication number: 20180092211Abstract: Provided is a printed circuit board including: an electronic component having a bottom face and a side face, in which first lands are provided on the bottom face; a printed wiring board having a mounting face, in which second lands corresponding to the first lands are provided on the mounting face, and in which the electronic component is mounted such that the bottom face faces the mounting face; a solder aggregation member provided outside the second lands on the mounting face; pieces of first solder each of which joins each of the first lands to corresponding one of the second lands; second solder formed on the solder aggregation member; and a thermosetting resin adhered to the bottom face of the electronic component outside the first lands and to the mounting face of the printed wiring board outside the second lands.Type: ApplicationFiled: August 28, 2017Publication date: March 29, 2018Inventor: Kunihiko Minegishi
-
Patent number: 9673141Abstract: A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion.Type: GrantFiled: March 3, 2015Date of Patent: June 6, 2017Assignee: CANON KABUSHIKI KAISHAInventors: Ichiro Kataoka, Osamu Hamamoto, Kazuya Notsu, Koji Tamura, Kunihiko Minegishi