Patents by Inventor Kunihiko Mita
Kunihiko Mita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7510998Abstract: A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 ?m. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.Type: GrantFiled: May 20, 2005Date of Patent: March 31, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiro Yamada, Akihiro Endo, Kunihiko Mita
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Patent number: 7484556Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.Type: GrantFiled: September 27, 2006Date of Patent: February 3, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
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Patent number: 7417078Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.Type: GrantFiled: March 20, 2002Date of Patent: August 26, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hironao Fujiki, Kazuhiko Tomaru, Ikuo Sakurai, Akio Suzuki, Kunihiko Mita
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Patent number: 7279224Abstract: A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.Type: GrantFiled: August 20, 2003Date of Patent: October 9, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yoshitaka Aoki, Tsutomu Yoneyama, Kunihiko Mita
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Publication number: 20070023179Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.Type: ApplicationFiled: September 27, 2006Publication date: February 1, 2007Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
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Patent number: 7141273Abstract: Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 ?m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.Type: GrantFiled: October 6, 2004Date of Patent: November 28, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Akihiro Endo, Kunihiko Mita, Akio Nakano, Kunihiro Yamada, Hiroaki Kizaki, Hiroaki Tetsuka
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Patent number: 7016196Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.Type: GrantFiled: March 20, 2002Date of Patent: March 21, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kazuhiko Tomaru, Kunihiko Mita, Tsutomu Yoneyama
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Publication number: 20050261140Abstract: A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 ?m. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.Type: ApplicationFiled: May 20, 2005Publication date: November 24, 2005Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiro Yamada, Akihiro Endo, Kunihiko Mita
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Patent number: 6940722Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 ?m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 ?m.Type: GrantFiled: January 22, 2003Date of Patent: September 6, 2005Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroaki Tetsuka, Kunihiko Mita, Kunihiro Yamada, Yoshitaka Aoki, Tsutomu Yoneyama
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Patent number: 6884660Abstract: The present invention relates to a thermoconducting silicone composition having a viscosity at 25° C. before curing of 10-1,000 Pa·s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.Type: GrantFiled: December 11, 2002Date of Patent: April 26, 2005Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroaki Tetsuka, Kunihiro Yamada, Kunihiko Mita
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Publication number: 20050084691Abstract: Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 ?m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.Type: ApplicationFiled: October 6, 2004Publication date: April 21, 2005Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Akihiro Endo, Kunihiko Mita, Akio Nakano, Kunihiro Yamada, Hiroaki Kizaki, Hiroaki Tetsuka
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Publication number: 20040094293Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.Type: ApplicationFiled: July 17, 2003Publication date: May 20, 2004Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
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Publication number: 20040057206Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.Type: ApplicationFiled: July 17, 2003Publication date: March 25, 2004Inventors: Kazuhiko Tomaru, Kunihiko Mita, Tsutomu Yoneyama
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Publication number: 20040054029Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.Type: ApplicationFiled: July 17, 2003Publication date: March 18, 2004Inventors: Hironao Fujiki, Kazuhiko Tomaru, Ikuo Sakurai, Akio Suzuki, Kunihiko Mita
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Publication number: 20040043229Abstract: A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.Type: ApplicationFiled: August 20, 2003Publication date: March 4, 2004Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Yoshitaka Aoki, Tsutomu Yoneyama, Kunihiko Mita
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Patent number: 6663964Abstract: A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.Type: GrantFiled: November 15, 2002Date of Patent: December 16, 2003Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiko Mita, Akio Suzuki, Tsutomu Yoneyama
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Patent number: 6610778Abstract: In a fluorosilicone rubber composition comprising (A) an organopolysiloxane having trifluoropropyl and (B) a silica filler, there are included (C) an organic peroxide of percarbonate type as a crosslinking agent and (D) a compound having a molecular weight of up to 10,000 and bearing in a molecule at least two substituents selected from among allyl, acryloyl, methacryloyl, epoxy and alkoxy groups as a co-crosslinking agent, whereby the vulcanization molding time is substantially reduced without detracting from physical properties.Type: GrantFiled: August 31, 2001Date of Patent: August 26, 2003Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kenichi Takita, Kunihiko Mita
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Publication number: 20030151898Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &mgr;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &mgr;m.Type: ApplicationFiled: January 22, 2003Publication date: August 14, 2003Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroaki Tetsuka, Kunihiko Mita, Kunihiro Yamada, Yoshitaka Aoki, Tsutomu Yoneyama
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Publication number: 20030127496Abstract: This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25° C. before curing is 10-1000 Pa·s, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps.Type: ApplicationFiled: December 11, 2002Publication date: July 10, 2003Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Hiroaki Tetsuka, Kunihiro Yamada, Kunihiko Mita
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Publication number: 20030096116Abstract: A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.Type: ApplicationFiled: November 15, 2002Publication date: May 22, 2003Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kunihiko Mita, Akio Suzuki, Tsutomu Yoneyama