Patents by Inventor Kunihiko Mita

Kunihiko Mita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7510998
    Abstract: A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 ?m. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: March 31, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiro Yamada, Akihiro Endo, Kunihiko Mita
  • Patent number: 7484556
    Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: February 3, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
  • Patent number: 7417078
    Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: August 26, 2008
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Kazuhiko Tomaru, Ikuo Sakurai, Akio Suzuki, Kunihiko Mita
  • Patent number: 7279224
    Abstract: A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: October 9, 2007
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshitaka Aoki, Tsutomu Yoneyama, Kunihiko Mita
  • Publication number: 20070023179
    Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
    Type: Application
    Filed: September 27, 2006
    Publication date: February 1, 2007
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
  • Patent number: 7141273
    Abstract: Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 ?m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: November 28, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akihiro Endo, Kunihiko Mita, Akio Nakano, Kunihiro Yamada, Hiroaki Kizaki, Hiroaki Tetsuka
  • Patent number: 7016196
    Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 21, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuhiko Tomaru, Kunihiko Mita, Tsutomu Yoneyama
  • Publication number: 20050261140
    Abstract: A silicone grease composition is provided comprising (A) 2-40% by weight of an organopolysiloxane having a kinematic viscosity of 50-500,000 mm2/s at 25° C., and (B) 60-98% by weight of at least one heat conductive filler selected from among metal powders, metal oxide powders and ceramic powders having a thermal conductivity of at least 10 W/m° C. and an average particle size of 0.1-15.0 ?m. Coarse particles are removed such that a 500-mesh oversize fraction is not more than 50 ppm and a 325-mesh oversize fraction is substantially zero.
    Type: Application
    Filed: May 20, 2005
    Publication date: November 24, 2005
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiro Yamada, Akihiro Endo, Kunihiko Mita
  • Patent number: 6940722
    Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 ?m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 ?m.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: September 6, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroaki Tetsuka, Kunihiko Mita, Kunihiro Yamada, Yoshitaka Aoki, Tsutomu Yoneyama
  • Patent number: 6884660
    Abstract: The present invention relates to a thermoconducting silicone composition having a viscosity at 25° C. before curing of 10-1,000 Pa·s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: April 26, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroaki Tetsuka, Kunihiro Yamada, Kunihiko Mita
  • Publication number: 20050084691
    Abstract: Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70° C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 ?m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.
    Type: Application
    Filed: October 6, 2004
    Publication date: April 21, 2005
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akihiro Endo, Kunihiko Mita, Akio Nakano, Kunihiro Yamada, Hiroaki Kizaki, Hiroaki Tetsuka
  • Publication number: 20040094293
    Abstract: A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
    Type: Application
    Filed: July 17, 2003
    Publication date: May 20, 2004
    Inventors: Kunihiko Mita, Kazuhiko Tomaru, Yoshitaka Aoki, Hironao Fujiki
  • Publication number: 20040057206
    Abstract: A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
    Type: Application
    Filed: July 17, 2003
    Publication date: March 25, 2004
    Inventors: Kazuhiko Tomaru, Kunihiko Mita, Tsutomu Yoneyama
  • Publication number: 20040054029
    Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.
    Type: Application
    Filed: July 17, 2003
    Publication date: March 18, 2004
    Inventors: Hironao Fujiki, Kazuhiko Tomaru, Ikuo Sakurai, Akio Suzuki, Kunihiko Mita
  • Publication number: 20040043229
    Abstract: A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.
    Type: Application
    Filed: August 20, 2003
    Publication date: March 4, 2004
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshitaka Aoki, Tsutomu Yoneyama, Kunihiko Mita
  • Patent number: 6663964
    Abstract: A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 16, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiko Mita, Akio Suzuki, Tsutomu Yoneyama
  • Patent number: 6610778
    Abstract: In a fluorosilicone rubber composition comprising (A) an organopolysiloxane having trifluoropropyl and (B) a silica filler, there are included (C) an organic peroxide of percarbonate type as a crosslinking agent and (D) a compound having a molecular weight of up to 10,000 and bearing in a molecule at least two substituents selected from among allyl, acryloyl, methacryloyl, epoxy and alkoxy groups as a co-crosslinking agent, whereby the vulcanization molding time is substantially reduced without detracting from physical properties.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: August 26, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kenichi Takita, Kunihiko Mita
  • Publication number: 20030151898
    Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &mgr;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &mgr;m.
    Type: Application
    Filed: January 22, 2003
    Publication date: August 14, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroaki Tetsuka, Kunihiko Mita, Kunihiro Yamada, Yoshitaka Aoki, Tsutomu Yoneyama
  • Publication number: 20030127496
    Abstract: This invention discloses a thermoconducting silicone composition comprising the following components (A)-(F), whereof the viscosity at 25° C. before curing is 10-1000 Pa·s, a method of installing this composition, a heat dissipating structure of a semiconductor device using the same, and a cured material formed by heating this composition in two steps.
    Type: Application
    Filed: December 11, 2002
    Publication date: July 10, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hiroaki Tetsuka, Kunihiro Yamada, Kunihiko Mita
  • Publication number: 20030096116
    Abstract: A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.
    Type: Application
    Filed: November 15, 2002
    Publication date: May 22, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunihiko Mita, Akio Suzuki, Tsutomu Yoneyama