Patents by Inventor Kunihiko Oishi

Kunihiko Oishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and method of fabricating same
    Patent number: 5872331
    Abstract: An improved hermetically sealed case for enclosing an electronic element, wherein the case has an upper portion and a lower portion connected together by atomic bonding. The upper portion includes through holes. Each hole forms a lead to provide a connection from the outside of the case to the element within the case. Each lead is arranged in the through hole to seal the hole hermetically and yet provide an electrical contact for the element. The sealed case prevents the electronic element from being deteriorated by hazardous gas generated by the conventional welding process used to seal such cases.
    Type: Grant
    Filed: September 12, 1994
    Date of Patent: February 16, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Daizo Ando, Syuji Kondo, Kunihiko Oishi
  • Method of manufacturing electronic component
    Patent number: 5850688
    Abstract: An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
    Type: Grant
    Filed: March 19, 1997
    Date of Patent: December 22, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Daizo Ando, Tadashi Nakamura, Shinji Umeda, Kunihiko Oishi
  • Electronic component and its manufacturing method
    Patent number: 5644478
    Abstract: An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
    Type: Grant
    Filed: January 31, 1995
    Date of Patent: July 1, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Daizo Ando, Tadashi Nakamura, Shinji Umeda, Kunihiko Oishi