Abstract: A semiconductor device includes a substrate, a semiconductor layer, an element region, and fin transistors. The substrate includes a principal surface. The semiconductor layer is formed as a surface layer or on the principal surface of the substrate, the surface layer being the principal surface of the substrate. The semiconductor layer has a crystal structure in which an angle between two of crystal orientations with equivalent relationships on a crystal plane having a correspondence with the principal surface of the substrate is 60 degrees or 120 degrees. The element region includes unit element regions formed on the principal surface of the substrate. The fin transistors are formed in the semiconductor layer, in the respective unit element regions. The fin transistors radially extend from a center toward an outer periphery of the element region. Adjacent two of the fin transistors have a spacing with a 60° angle or a 120° angle.

Abstract: The invention relates to a cutting device which cuts a web member, which includes fiber bundles which extend continuously in a machine direction MD and which is intermittently conveyed in said machine direction, in a crossing direction CD which crosses the machine direction. The cutting device has a plurality of disk shaped rotary blades which rotate about rotary shafts which extend along the machine direction while moving in said cross direction so as to thereby cut said web member when the web member is at a stop. The plurality of rotary blades are arranged so as to be substantially aligned in the crossing direction and includes a rotary blade which rotates in one direction and a rotary blade which rotates in the opposite direction.

Abstract: The invention relates to a cutting device which cuts a web member, which includes fiber bundles which extend continuously in a machine direction MD and which is intermittently conveyed in said machine direction, in a crossing direction CD which crosses the machine direction. The cutting device has a plurality of disk shaped rotary blades which rotate about rotary shafts which extend along the machine direction while moving in said cross direction so as to thereby cut said web member when the web member is at a stop. The plurality of rotary blades are arranged so as to be substantially aligned in the crossing direction and includes a rotary blade which rotates in one direction and a rotary blade which rotates in the opposite direction.

Abstract: The cutting device of the present invention is provided with a movement mechanism which moves together with a rotary blade member which is immovably fastened and which guides reciprocating movement of the movement mechanism, and a bearing which is placed between the guide mechanism and the movement mechanism to enable smooth movement of the movement mechanism with respect to the guide mechanism and, furthermore, is provided with a waste removing device which is attached to the movement mechanism and which blocks entry of fiber waste which is produced when cutting the continuous web member to the inside of the bearing by removing fiber waste which has deposited on said guide mechanism from the guide mechanism.