Patents by Inventor Kunihiko Sanada

Kunihiko Sanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5552618
    Abstract: A master-slice semiconductor integrated circuit device includes a substrate for an input/output circuit section, which is segmented into a plurality of segments during a master processing step. In a slice processing step, slice cells are formed, using different substrate segments. Input/output circuits are formed by respective slice cells so that desired different supply voltages can be applied to input/output circuits on different substrate segments.
    Type: Grant
    Filed: October 19, 1994
    Date of Patent: September 3, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Taniguchi, Ichiro Tomioka, Kunihiko Sanada, Masatomi Okabe
  • Patent number: 5404035
    Abstract: A master-slice semiconductor integrated circuit device includes a substrate for an input/output circuit section, which is segmented into a plurality of segments during a master processing step. In a slice processing step, slice cells are formed, using different substrate segments. Input/output circuits are formed by respective slice cells so that desired different supply voltages can be applied to input/output circuits on different substrate segments.
    Type: Grant
    Filed: June 10, 1993
    Date of Patent: April 4, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Taniguchi, Ichiro Tomioka, Kunihiko Sanada, Masatomi Okabe