Abstract: A pattern data inspection method includes the steps of (a) carrying out a logical/sizing process with respect to original pattern data, (b) carrying out a reverse-logical/reverse-sizing process with respect to pattern data subjected to the logical/sizing process, and (c) carrying out a logical process with respect to the original pattern data and pattern data subjected to the reverse-logical/reverse-sizing process, and inspecting the pattern data subjected to the logical/sizing process.

Abstract: A system for inspecting exposure pattern data in the form of coordinate data for forming a reticle of a semiconductor integrated circuit device, on the basis of video signals. The inspection system includes a unit for inputting exposure pattern data in the form of coordinate data form in response to a request for a test region, converting the input exposure pattern data to data corresponding to an actual pattern in a two-dimensional form, storing the converted data, and outputting the stored data in the form of video signals; a unit for testing the exposure pattern data from the inputting and converting unit on the basis of the video signals under a predetermined pattern rule; and a unit for outputting data tested at the pattern testing unit. The pattern test unit includes a variety of test circuits, such as a slit test circuit, a comparator, a combination circuit, etc., used for a pattern test.