Abstract: A nitride semiconductor laser device of one embodiment of the present disclosure includes a single-crystal substrate, a base layer, a sheet-shaped structure, a light emitting layer, and a resonator mirror. The single-crystal substrate extends in one direction. The base layer is provided on the single-crystal substrate and includes a nitride semiconductor. The sheet-shaped structure is provided on the base layer to stand in a direction perpendicular to the base layer. The sheet-shaped structure has an area of a side surface that is greater than an area of an upper surface. The side surface extends in a longitudinal direction of the single-crystal substrate. The sheet-shaped structure includes a nitride semiconductor. The light emitting layer is provided at least on the side surface of the sheet-shaped structure. The light emitting layer includes a nitride semiconductor. The resonator mirror is provided by a pair of end surfaces of the sheet-shaped structure that oppose each other in the longitudinal direction.

Abstract: A semiconductor device having high operational reliability is provided. This semiconductor device includes a channel layer, a barrier layer, and a first spacer layer provided between the channel layer and the barrier layer, and a second spacer layer provided between the first spacer layer and the barrier layer. The channel layer includes a first nitride semiconductor having a first band gap. The barrier layer includes a second nitride semiconductor having a second band gap larger than the first band gap of the first nitride semiconductor. The first spacer layer includes Alx1Iny1Ga(1-x1-y1)N (0<x1?1, 0? y1<1, 0?x1+y1?1). The second spacer layer includes Alx2Iny2Ga(1-x2-y2)N (0<x2<x1?1, 0?y2<1, 0<x2+y2<1).

Abstract: A semiconductor device capable of reducing density of threading potential without increasing a leakage current is provided. A semiconductor device including a channel layer that is included in a laminated body of a nitride semiconductor provided on a substrate, and a barrier layer that is included in the laminated body on an upper layer side with respect to the channel layer, in which the laminated body on a lower layer side with respect to the channel layer includes an n-type conversion factor that converts the nitride semiconductor into an n-type in a concentration profile having at least one or more peaks in a lamination direction of the laminated body, and a compensated area including 6×1018 cm?3 or more of a compensation factor for compensating for the n-type conversion factor is provided in the laminated body on an upper layer side with respect to peaks of the concentration profile of the n-type conversion factor.

Abstract: A light emitting device according to an embodiment of the present disclosure includes: a first layer including Alx2Inx1Ga(1-x1-x2) N (0<x1<1, 0?x2<1); a second layer that is provided on the first layer and includes Aly2Iny1Ga(1-y1-y2) N (0<y1<1, 0?y2<1) that is lattice relaxed with respect to the first layer; and a third layer that is provided on the second layer, includes Alz2Inz1Ga(1-z1-z2) N (0<z1<1, 0?z2<1) that is lattice relaxed with respect to the second layer, and includes an active layer. A lattice constant aGAN of GaN in an in-plane direction, a lattice constant al of the first layer in an in-plane direction, a lattice constant a2 of the second layer in an in-plane direction, and a lattice constant a3 of the third layer in an in-plane direction have a relationship of aGAN<a2<a1, a3.

Abstract: A semiconductor device including: a channel layer; a spacer layer; an intermediate layer; and a barrier layer. The channel layer includes a first nitride semiconductor. The spacer layer includes a second nitride semiconductor having a larger band gap than a band gap of the first nitride semiconductor. The spacer layer is provided on the channel layer. The intermediate layer includes Alx1Iny1Ga(1-x1-y1)N(0<x1<1, 0<y1<1, and 0<x1+y1<1). The intermediate layer is provided on the spacer layer. The barrier layer includes Alx2In(1-x2)N(0<x2<1). The barrier layer is provided on the intermediate layer.

Abstract: A compound semiconductor layer stack includes: a first layer 11 being formed on a base 14 and including an island-shaped Alx1Iny1Ga(1-x1-y1)N; a second layer 12 being formed on the first layer 11 and including Alx2Iny2Ga(1-x2-y2)N; and a third layer 13 being formed on an entire surface including a top of the second layer 12, the third layer 13 including Alx3Ga(1-x3)N (provided that the following hold true: 0?x1<1; 0?x2<1; 0?x3<1; 0?y1<1; and 0<y2<1), and the third layer 13 has a top surface 13A that is flat.

Abstract: A nitride semiconductor laser device of one embodiment of the present disclosure includes a single-crystal substrate, a base layer, a sheet-shaped structure, a light emitting layer, and a resonator mirror. The single-crystal substrate extends in one direction. The base layer is provided on the single-crystal substrate and includes a nitride semiconductor. The sheet-shaped structure is provided on the base layer to stand in a direction perpendicular to the base layer. The sheet-shaped structure has an area of a side surface that is greater than an area of an upper surface. The side surface extends in a longitudinal direction of the single-crystal substrate. The sheet-shaped structure includes a nitride semiconductor. The light emitting layer is provided at least on the side surface of the sheet-shaped structure. The light emitting layer includes a nitride semiconductor. The resonator mirror is provided by a pair of end surfaces of the sheet-shaped structure that oppose each other in the longitudinal direction.

Abstract: A light-emitting device according to one embodiment of the present disclosure includes: a substrate; a first quantum well layer including Alx2Inx1Ga(1-x1-x2)N (0<x1<1, 0?x2<1) and including a light-emitting region; a barrier layer provided between the substrate and the first quantum well layer; and a second quantum well layer including Aly2Iny1Ga(1-y1-y2)N (0<y1<1, 0?y2<1) and having a thickness of less than 4.0 monolayers and provided between the substrate and the barrier layer, at a position 8 nm or more and less than 50 nm away from the first quantum well layer.

Abstract: A light emitting device according to an embodiment of the present disclosure includes: a first layer including Alx2Inx1Ga(1-x1-x2) N (0<x1<1, 0?x2<1); a second layer that is provided on the first layer and includes Aly2Iny1Ga(1-y1-y2) N (0<y1<1, 0?y2<1) that is lattice relaxed with respect to the first layer; and a third layer that is provided on the second layer, includes Alz2Inz1Ga(1-z1-z2) N (0<z1<1, 0?z2<1) that is lattice relaxed with respect to the second layer, and includes an active layer. A lattice constant aGAN of GaN in an in-plane direction, a lattice constant al of the first layer in an in-plane direction, a lattice constant a2 of the second layer in an in-plane direction, and a lattice constant a3 of the third layer in an in-plane direction have a relationship of aGAN<a2<a1, a3.

Abstract: A template substrate including: a first layer that includes Alx2Inx1Ga(1-x1-x2)N (0<x1<1, 0?x2<1) and has a lattice constant a1 in an in-plane direction greater than a lattice constant of GaN in the in-plane direction, the first layer being lattice-relaxed; a second layer that is stacked on the first layer to be lattice-matched to the first layer and includes AlyGa(1-y)N (0?y<1); and a third layer that is provided opposed to the first layer with the second layer being interposed therebetween, the third layer being lattice-matched to the second layer and including Alz2Inz1Ga(0-z1-z2)N (0<z1<1, 0?z2<1).

Abstract: A semiconductor optical device includes a laminated structure constituted of a first compound semiconductor layer of an n type, an active layer, and a second compound semiconductor layer of a p type, the active layer including at least 3 barrier layers and well layers interposed among the barrier layers, and the semiconductor optical device satisfying Egp-BR>Egn-BR>EgWell when a bandgap energy of the barrier layer adjacent to the second compound semiconductor layer is represented by Egp-BR, a bandgap energy of the barrier layer between the well layers is represented by EgWell, and a bandgap energy of the barrier layer adjacent to the first compound semiconductor layer is represented by Egn-BR.

Abstract: A semiconductor optical device includes a laminated structure constituted of a first compound semiconductor layer of an n type, an active layer, and a second compound semiconductor layer of a p type, the active layer including at least 3 barrier layers and well layers interposed among the barrier layers, and the semiconductor optical device satisfying Egp-BR>Egn-BR>EgWell when a bandgap energy of the barrier layer adjacent to the second compound semiconductor layer is represented by Egp-BR, a bandgap energy of the barrier layer between the well layers is represented by EgWell, and a bandgap energy of the barrier layer adjacent to the first compound semiconductor layer is represented by Egn-BR.

Abstract: There is provided a light-emitting element including a laminated structure including a first compound semiconductor layer having a first conductivity type, a second compound semiconductor layer having a second conductivity type different than the first conductivity type, and a third compound semiconductor layer formed between the first and second compound semiconductor layers and including an active layer. A second end surface of the second compound semiconductor layer and a third end surface of the third compound semiconductor layer are formed at respective second and third angles theta2 and theta3 relative to a virtual vertical direction of the laminated structure and satisfy the following relationship: “absolute value of theta3 is equal to or greater than 0 degree and smaller than absolute value of theta2”.

Abstract: There is provided a light-emitting element including a laminated structure including a first compound semiconductor layer having a first conductivity type, a second compound semiconductor layer having a second conductivity type different than the first conductivity type, and a third compound semiconductor layer formed between the first and second compound semiconductor layers and including an active layer. A second end surface of the second compound semiconductor layer and a third end surface of the third compound semiconductor layer are formed at respective second and third angles theta2 and theta3 relative to a virtual vertical direction of the laminated structure and satisfy the following relationship: “absolute value of theta3 is equal to or greater than 0 degree and smaller than absolute value of theta2”.

Abstract: A semiconductor device includes: a semiconductor substrate made of a hexagonal Group III nitride semiconductor and having a semi-polar plane; and an epitaxial layer formed on the semi-polar plane of the semiconductor substrate and including a first cladding layer of a first conductive type, a second cladding layer of a second conductive type, and a light-emitting layer formed between the first cladding layer and the second cladding layer, the first cladding layer being made of Inx1Aly1Ga1-x1-y1N, where x1>0 and y1>0, the second cladding layer being made of Inx2Aly2Ga1-x2-y2N, where0?x2?about 0.02 and about 0.03?y2?about 0.07.

Abstract: A nitride semiconductor laser comprises a conductive support base having a primary surface of gallium nitride based semiconductor, an active layer on the primary surface, and a p-type cladding region on the primary surface. The primary surface is tilted to a reference plane perpendicular to a reference axis extending in the c-axis direction of the gallium nitride based semiconductor. The p-type cladding region comprises a first p-type group III nitride semiconductor layer of an AlGaN layer anisotropically-strained, and a second p-type group III nitride semiconductor layer of material different from the AlGaN layer. The first p-type group III nitride semiconductor layer is provided between the second p-type group III nitride semiconductor layer and the active layer. The AlGaN layer has the largest bandgap in the p-type cladding region. The second p-type group III nitride semiconductor layer has a resistivity lower than the first p-type group III nitride semiconductor layer.

Abstract: A nitride semiconductor light-emitting device has a semiconductor ridge, and includes a first inner-layer between an active layer and an n-type cladding and a second inner-semiconductor layer between the active layer and a p-type cladding. The first inner-layer, active layer and second inner-layer constitute a core-region. The n-type cladding, core-region and p-type cladding constitute a waveguide-structure. The active layer and the first inner-layer constitute a first heterojunction inclined at an angle greater than zero with respect to a reference plane of the c-plane of the nitride semiconductor of the n-type cladding. Piezoelectric polarization of the well layer is oriented in a direction from the p-type cladding toward the n-type cladding. The second inner-layer and InGaN well layer constitute a second heterojunction. A distance between the ridge bottom and the second heterojunction is 200 nm or less. The ridge includes a third heterojunction between the second inner-layer and the p-type cladding.

Abstract: A nitride semiconductor laser includes an electrically conductive support substrate with a primary surface of a gallium nitride based semiconductor, an active layer provided above the primary surface, and a p-type cladding region provided above the primary surface. The primary surface is inclined relative to a reference plane perpendicular to a reference axis extending in a direction of the c-axis of the gallium nitride based semiconductor. The p-type cladding region includes first and second p-type Group III nitride semiconductor layers. The first p-type semiconductor layer comprises an InAlGaN layer including built-in anisotropic strain. The second p-type semiconductor layer comprises semiconductor different from material of the InAlGaN layer. The first nitride semiconductor layer is provided between the second p-type semiconductor layer and the active layer. The second p-type semiconductor layer has a resistivity lower than that of the first p-type semiconductor layer.

Abstract: A gallium nitride-based semiconductor laser device with reduced threshold current. The gallium nitride-based semiconductor laser device is provided with an n-type cladding layer, an n-side light guide layer, an active layer, a p-side light guide layer, and a p-type cladding layer. The n-side light guide layer and the p-side light guide layer both contain indium. Each of indium compositions of the n-side light guide layer and the p-side light guide layer is not less than 2% and not more than 6%. A film thickness of the n-type cladding layer is in the range of not less than 65% and not more than 85% of a total of the film thickness of the n-type cladding layer and a film thickness of the p-type cladding layer.

Abstract: A group-III nitride semiconductor device includes a light emitting layer emitting light of a wavelength in the range of 480 to 600 nm; a first contact layer over the light emitting layer; a second contact layer in direct contact with the first contact layer; and a metal electrode in direct contact with the second contact layer. The first and second contact layers comprise a p-type gallium nitride-based semiconductor. The p-type dopant concentration of the first contact layer is lower than that of the second contact layer. The light emitting layer comprises a gallium nitride-based semiconductor. The interface between the first and second contact layers tilts at an angle of not less than 50 degrees and smaller than 130 degrees from a plane orthogonal to a reference axis extending along the c-axis. The second contact layer has a thickness within the range of 1 to 50 nm.