Abstract: The present invention is mainly for providing a flake copper powder for a conductive paste with particle properties which are defined by that the particle thickness is thinner being possible for use to form an electrode or a circuit, and a production process thereof. To achieve the object of producing the following particles, each powder particles shape is plastically processed into a flake-shape, wherein the flake copper powder has a cumulative particle diameter D50 of 10 ?m or smaller measured with laser diffraction scattering particle size distribution method. The D10, D50 and D90 measured with the laser diffraction scattering particle size distribution method are illustrative and the SD/D50 value measured by the standard deviation of particle distribution with the laser diffraction scattering particle size distribution, is 0.55 or larger and/or a D90/D10 of 4.5 or smaller.