Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.

Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.

Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.

Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.

Abstract: Acrylic fiber comprising an acrylonitrile-based copolymer comprising 96.0 to 98.5% by weight of acrylonitrile units, 1.0 to 3.5% by weight of acrylamide units and 0.5% by weight or more of methacrylic acid units, the percentage by weight (A) of acrylamide units and the percentage by weight (M) of methacrylic acid units in the copolymer satisfying the following equations (I) and (II), and adsorbed iodine in an amount of 1% by weight or less based on the weight of the copolymer:X=0.21 to 0.23 (I)M+A.sup.x =1.82 to 2.18 (II)A copolymer having the above-mentioned composition is spun by a wet process, while adjusting the modulus in tension of coagulated fiber to approximately 2.0-3.0 g/d, wherein d means denier in terms of the weight of polymer in the coagulated fiber. There is provided acrylic fiber which permits production of carbon fiber with a high tensile strength and a high tensile modulus by pyrolysis for a shorter time.

Abstract: An acrylonitrile polymer film is disclosed which film comprising a polymer containing higher than 80% by weight of acrylonitrile units, having higher than 300,000 of weight average molecular weight, and having molar fraction Ne for the segment of polymerization initiator bonded to the terminal of the polymer satisfying the following equation:Mw.times.Ne.ltoreq.

Abstract: Disclosed are heat-resisting porous membranes or hydrophilized heat-resisting porous membranes comprising a polyolefin, especially a polyethylene or a polypropylene membrane having a crosslinked polymer held thereon, the crosslinked polymer being composed principally of (a) a polymerizable monomer containing one acid anhydride group or two esterified carboxyl groups or a monomer having at least one carboxylic group and (b) divinylbenzene, or of (a), (b) and further (c) styrene or a derivative thereof, or of (b) and (c). These membranes are prepared by thermally polymerizing some of monomer components from (a) through (c) held on at least a part of the surface of the porous membranes and optionally by further hydrophilizing the crosslinked polymer. The resulting porous membranes are useful for membrane separation requiring steam sterilization and for membrane separation of water of a high temperature.

Abstract: A method is described for reducing a hydroxocobalt (III) Schiff base complex to a cobalt (II) Schiff base complex by heating the former complex to a temperature below the decomposition point of the latter complex.