Patents by Inventor Kunihiro Morinaga

Kunihiro Morinaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240301168
    Abstract: Provided is a curable composition containing an epoxy resin (A), an aliphatic amine compound and/or an alicyclic amine compound (B), core-shell particles (C), and an imidazole compound (D), wherein a ratio H/E of an amount by mole H of active hydrogen in the aliphatic amine compound and/or the alicyclic amine compound (B) to an amount by mole E of epoxy group in the epoxy resin (A) is 0.3 to 0.9. The curable composition has rapid curing properties, and forms a cured object having favorable heat resistance and toughness. Therefore, the curable composition can be suitably used for a fiber-reinforced composite material and a molded fiber-reinforced resin article, in addition to an application in which the curable composition is cured.
    Type: Application
    Filed: March 17, 2022
    Publication date: September 12, 2024
    Applicants: DIC Corporation, DIC Corporation
    Inventors: Akito Kawasaki, Kunihiro Morinaga, Makoto Kimura
  • Publication number: 20240218112
    Abstract: Provided is a phenolic resin being a reaction product of a catechol compound and an ortho-xylylene skeleton-containing compound, and having a catechol skeleton derived from the catechol compound and an ortho-xylylene skeleton derived from the ortho-xylylene skeleton-containing compound. A cured product obtained by using an epoxy resin obtained by using this phenolic resin can exhibit high heat resistance and high bending properties (bending strength, bending elastic modulus, and the like) and is thus suitably used for fiber-reinforced composite materials and fiber-reinforced resin molded products.
    Type: Application
    Filed: April 21, 2022
    Publication date: July 4, 2024
    Applicants: DIC Corporation, DIC Corporation
    Inventors: Shinji Onda, Kunihiro Morinaga
  • Patent number: 11767424
    Abstract: The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: September 26, 2023
    Assignee: DIC Corporation
    Inventors: Shinji Onda, Kunihiro Morinaga
  • Publication number: 20220403154
    Abstract: The present invention provides a polyfunctional phenolic resin and a polyfunctional epoxy resin having low viscosity and having excellent mechanical properties and heat resistance of a cured product to be obtained, a curable resin composition containing these, and a cured product thereof. Specifically, provided are a polyfunctional phenolic resin formed with a naphthol structure optionally having a substituent on an aromatic ring and a catechol structure optionally having a methyl group as a substituent on an aromatic ring bonded together via a methylene group optionally having a substituent, a polyfunctional epoxy resin obtained by epoxidizing the polyfunctional phenolic resin, a curable resin composition containing any of these, and a cured product thereof.
    Type: Application
    Filed: October 1, 2020
    Publication date: December 22, 2022
    Applicant: DIC Corporation
    Inventors: Shinji Onda, Kunihiro Morinaga
  • Publication number: 20220403099
    Abstract: Provided are a curable composition which is rapidly curable and which gives cured products with good heat resistance, a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin-molded article, and a method for manufacturing the fiber-reinforced resin-molded article. Provided are a curable composition containing an epoxy resin (A), an aliphatic and/or alicyclic amine compound (B), and an imidazole compound (C), wherein the ratio H/E of the number of moles H of active hydrogen in the aliphatic and/or alicyclic amine compound (B) to the number of moles E of an epoxy group in the epoxy resin (A) is in the range of 0.2 to 0.9; a cured product thereof; a fiber-reinforced composite material; a fiber-reinforced resin-molded article; and a method for manufacturing the fiber-reinforced resin-molded article.
    Type: Application
    Filed: October 29, 2020
    Publication date: December 22, 2022
    Applicant: DIC Corporation
    Inventors: Akito Kawasaki, Makoto Kimura, Kunihiro Morinaga
  • Patent number: 11286385
    Abstract: The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 29, 2022
    Assignee: DIC Corporation
    Inventors: Koji Hayashi, Nana Sugimoto, Kunihiro Morinaga
  • Patent number: 11015019
    Abstract: Provided are an epoxy resin including: an epoxidized product of monoalkyl dihydroxybenzene; and a compound that is detected in the molecular weight range from a molecular weight at the peak top of the epoxidized product of the monoalkyl dihydroxybenzene to the molecular weight at the peak top+20 to 40 and has a peak area % of 0.1% to 0.8% in a GPC chart, and an epoxy resin including an epoxidized product of monoalkyl catechol in which the ratio of the total content of a cyclic compound having a cyclic structure that has two adjacent oxygen atoms derived from the monoalkyl catechol as constituent atoms and a monoglycidyletherified product of the monoalkyl catechol to the content of a diglycidyletherified product of the monoalkyl catechol is in the range of 0.10 to 0.40 as measured by high performance liquid chromatography.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: May 25, 2021
    Assignee: DIC Corporation
    Inventors: Yousuke Hirota, Shota Tanii, Koji Hayashi, Kunihiro Morinaga
  • Patent number: 10982040
    Abstract: The present invention provides an epoxy resin including a reaction product of 1,2,3-trihydroxybenzene and an epihalohydrin, the epoxy resin containing a cyclic compound that has acyclic structure containing, as constitutional atoms, two adjacent oxygen atoms derived from 1,2,3-trihydroxybenzene, the cyclic compound being contained in an amount of 0.040 to 0.115 mol based on 100 g of the epoxy resin. The epoxy resin can be an alternative as a biobased polymer, is liquid, and is excellent in thermal resistance.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 20, 2021
    Assignee: DIC Corporation
    Inventors: Nana Sugimoto, Koji Hayashi, Kunihiro Morinaga
  • Publication number: 20200308393
    Abstract: The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.
    Type: Application
    Filed: November 8, 2018
    Publication date: October 1, 2020
    Inventors: Koji Hayashi, Nana Sugimoto, Kunihiro Morinaga
  • Publication number: 20200231741
    Abstract: The present invention provides an epoxy resin including a reaction product of 1,2,3-trihydroxybenzene and an epihalohydrin, the epoxy resin containing a cyclic compound that has acyclic structure containing, as constitutional atoms, two adjacent oxygen atoms derived from 1,2,3-trihydroxybenzene, the cyclic compound being contained in an amount of 0.040 to 0.115 mol based on 100 g of the epoxy resin. The epoxy resin can be an alternative as a biobased polymer, is liquid, and is excellent in thermal resistance.
    Type: Application
    Filed: March 29, 2018
    Publication date: July 23, 2020
    Inventors: Nana Sugimoto, Koji Hayashi, Kunihiro Morinaga
  • Publication number: 20190202974
    Abstract: Provided are an epoxy resin including: an epoxidized product of monoalkyl dihydroxybenzene; and a compound that is detected in the molecular weight range from a molecular weight at the peak top of the epoxidized product of the monoalkyl dihydroxybenzene to the molecular weight at the peak top+20 to 40 and has a peak area % of 0.1% to 0.8% in a GPC chart, and an epoxy resin including an epoxidized product of monoalkyl catechol in which the ratio of the total content of a cyclic compound having a cyclic structure that has two adjacent oxygen atoms derived from the monoalkyl catechol as constituent atoms and a monoglycidyletherified product of the monoalkyl catechol to the content of a diglycidyletherified product of the monoalkyl catechol is in the range of 0.10 to 0.40 as measured by high performance liquid chromatography.
    Type: Application
    Filed: May 11, 2017
    Publication date: July 4, 2019
    Inventors: Yousuke Hirota, Shota Tanii, Koji Hayashi, Kunihiro Morinaga
  • Patent number: 10329231
    Abstract: The present invention provides an epoxy compound which is 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene. Also, the present invention provides a method for producing [1,1?-binaphthalene]-2,2?,7,7?-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1?-binaphthalene]-2,2?,7,7?-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1?-binaphthalene]-2,2?,7,7?-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1?-binaphthalene]-2,2?,7,7?-tetraol or [1,1?-binaphthalene]-2,2?,7,7?-tetraol monohydrate with epihalohydrin.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 25, 2019
    Assignee: DIC Corporation
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita, Masamichi Hayashi
  • Patent number: 10047256
    Abstract: The present invention provides an epoxy resin composition including 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: August 14, 2018
    Assignee: DIC Corporation
    Inventors: Yasuyo Yoshimoto, Atsushi Oshio, Kunihiro Morinaga, Hiroshi Kinoshita, Daisuke Ito
  • Patent number: 10047190
    Abstract: Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p?] conjugate is in a range of 30% to 45% relative to the total of the [o, p?] conjugate+the [o, o?] conjugate+the [p, p?] conjugate in terms of the area ratio according to a liquid chromatography measurement.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: August 14, 2018
    Assignee: DIC CORPORATION
    Inventors: Kunihiro Morinaga, Makoto Kimura, Koji Hayashi, Takamitsu Nakamura
  • Patent number: 9975987
    Abstract: Provided is an epoxy resin which has a low viscosity and excellent impregnation capability into reinforcing fibers and provides a cured product having a high elastic modulus and excellent heat resistance when the epoxy resin is used for a fiber-reinforced resin material, and a method for producing the epoxy resin, a curable resin composition, and a cured product thereof, a fiber-reinforced composite material, and a molded article. An epoxy resin which is polyglycidyl ether that is a polycondensation product of phenol and hydroxybenzaldehyde, the resin includes the trinuclear body (X) represented by the following Structural Formula (1), in which the content of a [o,p,p] bonding body (x1) represented by the following Structural Formula (1-1) among the trinuclear body (X) is in the range of 5% to 18% in terms of an area ratio as measured by liquid chromatography.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: May 22, 2018
    Assignee: DIC Corporation
    Inventors: Koji Hayashi, Makoto Kimura, Kunihiro Morinaga, Shigeki Matsui
  • Publication number: 20180002261
    Abstract: The present invention provides an epoxy compound which is 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene. Also, the present invention provides a method for producing [1,1?-binaphthalene]-2,2?,7,7?-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1?-binaphthalene]-2,2?,7,7?-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1?-binaphthalene]-2,2?,7,7?-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1?-binaphthalene]-2,2?,7,7?-tetraol or [1,1?-binaphthalene]-2,2?,7,7?-tetraol monohydrate with epihalohydrin.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 4, 2018
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita, Masamichi Hayashi
  • Publication number: 20170342194
    Abstract: Disclosed is a method for producing a biphenyl-skeleton-containing epoxy resin represented by Formula (1) described below including a step of allowing polyvalent hydroxy biphenyl obtained by a production step including a regioselective cross-coupling reaction to react with epihalohydrin. (In the formula, k1 and l1 each represent an integer of 0 to 4, m and n each represent an integer of 1 to 5, R1 and R2 each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent group, and R1 and R2 may be identical to each other or different from each other. (Provided that left and right phenyl structures of a biphenyl skeleton are different from each other.
    Type: Application
    Filed: August 15, 2017
    Publication date: November 30, 2017
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita
  • Publication number: 20170275416
    Abstract: Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p?[ conjugate is in a range of 30% to 45% relative to the total of the [o, p?[ conjugate+the [o, o?] conjugate+the [p, p?[ conjugate in terms of the area ratio according to a liquid chromatography measurement.
    Type: Application
    Filed: August 27, 2015
    Publication date: September 28, 2017
    Applicant: DIC Corporation
    Inventors: Kunihiro MORINAGA, Makoto KIMURA, Koji HAYASHI, Takamitsu NAKAMURA
  • Patent number: 9765179
    Abstract: Disclosed is a method for producing a biphenyl-skeleton-containing epoxy resin represented by Formula (1) described below including a step of allowing polyvalent hydroxy biphenyl obtained by a production step including a regioselective cross-coupling reaction to react with epihalohydrin. (In the formula, k1 and l1 each represent an integer of 0 to 4, m and n each represent an integer of 1 to 5, R1 and R2 each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent group, and R1 and R2 may be identical to each other or different from each other. (Provided that left and right phenyl structures of a biphenyl skeleton are different from each other.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: September 19, 2017
    Assignee: DIC CORPORATION
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita
  • Patent number: 9738580
    Abstract: The present invention provides an epoxy compound which is 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene. Also, the present invention provides a method for producing [1,1?-binaphthalene]-2,2?,7,7?-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1?-binaphthalene]-2,2?,7,7?-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1?-binaphthalene]-2,2?,7,7?-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1?-binaphthalene]-2,2?,7,7?-tetraol or [1,1?-binaphthalene]-2,2?,7,7?-tetraol monohydrate with epihalohydrin.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: August 22, 2017
    Assignee: DIC Corporation
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita, Masamichi Hayashi