Patents by Inventor Kunihiro Nakata

Kunihiro Nakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5583750
    Abstract: In an electronic device comprising a first substrate having at least one first electronic circuit element thereon, a second substrate having at least one second electronic circuit element thereon, a substrate connector through which the first and second electronic circuit elements are connected electrically to each other, and an electrically grounded chassis receiving the first and second substrates, the first substrate has thereon a first electromagnetic shielding plate including an electrically conductive material, the second substrate has thereon a second electromagnetic shielding plate including the electrically conductive material, the first and second electromagnetic shielding plates are electrically connected to the chassis, and a wire length between a wire length limited electronic circuit element on the first substrate and another of the electronic circuit elements on the second substrate is limited for ensuring a high speed responsive operation therebetween.
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: December 10, 1996
    Assignees: Hitachi, Ltd., Hitachi Microcomputer System, Ltd.
    Inventors: Kunihiro Nakata, Seiichi Kawashima, Fumio Kishida