Abstract: An energy-sensitive composition that yields a cured product with excellent crack resistance, a cured product of the composition, and a method of forming a cured product. The energy-sensitive composition includes a polysilane and a thermal base generator, in which the thermal base generator includes a compound represented by the following formula (b1): in which Rb1 and Rb2 each independently represents a hydrogen atom, a halogen atom, a nitro group, an alkyl group, an aryl group, an arylalkyl group, or an alkoxy group, Rb3 represents a hydrogen atom or an alkyl group; n1 and n2 each independently represent an integer of 0 or more and 4 or less; Zq+ represents a q-valent organic cation composed of a base having a pKa of greater than 15; and q represents an integer of 1 or more.

Abstract: An energy-sensitive composition including a polysilane, a base generator, and a solvent, the base generator including a compound represented by formula (b1) and a photo base generator: in which Rb1 to Rb3 each independently represents a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfonato group, phosphino group, phosphinyl group, phosphonato group or organic group; Rb4 and Rb5 each independently represent a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonato group, phosphino group, phosphinyl group, phosphono group, phosphonato group or aliphatic group; and Rb6 represents a hydrogen atom, alkyl group or alkoxy group.

Abstract: An energy-sensitive composition that yields a cured product with excellent thermal resistance and crack resistance, a cured product of the composition, and a method of forming a cured product. The energy-sensitive composition includes a polysilane and a thermal base generator, in which the thermal base generator includes an ionic compound and a nonionic compound. An anion moiety in the ionic compound preferably includes at least one of an anion having an oxaxanthone skeleton, an anion having a ketoprofen skeleton, and an anion having a fluorenone skeleton.

Abstract: An energy-sensitive composition that yields a cured product with excellent crack resistance, a cured product of the composition, and a method of forming a cured product. The composition includes a polysilane and a thermal base generator, the thermal base generator including a compound represented by the following formula (b1), in which Rb1 and Rb2 each independently represents a halogen atom, a nitro group, an alkyl group, an aryl group, an arylalkyl group, or an alkoxy group, n1 represents an integer of 0 or more and 4 or less, n2 represents an integer of 0 or more and 3 or less, Zq+ represents a counter cation composed of an organic cation or a metal cation, and q represents an integer of 1 or more.

Abstract: To provide a curable composition which can easily form an optical film with good fluorescence efficiency and includes quantum dots (B), a film made of a cured product of the curable composition, an optical film for a light-emitting display element made of the film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. A film is formed by curing a curable composition which includes an epoxy compound (A) having two or more epoxy groups and including a cyclic structure other than an oxirane ring, quantum dots (B), and an acid generator (C).

Abstract: Provided are: a method for producing a quantum dot dispersion enabling formation of a substrate having quantum dots or a film comprising quantum dots which exhibits desired quantum dots, when the quantum dot dispersion is used for dispersing quantum dots on a surface of the substrate or preparing a composition for producing the film containing quantum dots, and a quantum dot dispersion that can be suitably produced by the above method. The quantum dot dispersion is produced by using quantum dots containing chalcogenide as a material of surface and dispersing the quantum dots (A) in the dispersion medium (B) comprising an organic solvent (B1) comprising a chalcogen element.

Abstract: Provided are: a method for producing a quantum dot-containing film enabling formation of a quantum dot-containing film exhibiting desired quantum yield; and a composition for producing a quantum dot-containing film suitably used for the method. In a method for producing a quantum dot-containing film using a composition including quantum dots (A) containing a chalcogenide as a surface material, a base component (C), and a solvent (S), a heating step to heat a quantum dot-containing film in an atmosphere with a lower oxygen concentration than air is conducted.

Abstract: The present invention provides: a liquid composition which can be suitably used for production of an optical film having a favorable fluorescence efficiency and includes quantum dots (A), a quantum dot-containing film obtained by drying and/or curing the liquid composition, an optical film for a light-emitting display element made of the quantum dot-containing film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. An ionic liquid (B), and a solvent (S) are incorporated into a liquid composition including quantum dots (A), in which the solvent (S) includes a solvent (S1), the solvent (S1) being a compound having a cyclic skeleton and including a heteroatom other than a hydrogen atom and a carbon atom.

Abstract: A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.

Abstract: An energy-sensitive composition including at least one of a silane compound monomer capable of forming a polysilane compound, a silane compound oligomer and the polysilane compound, and a base generator (B) represented by the following formula (1): in which R1 to R11 each independently represents a hydrogen atom, a halogen atom, a nitro group, an alkyl group, an aryl group, an arylalkyl group or an alkoxy group, R5 and R6 may be connected to each other via a single bond or a divalent linking group, Zq+ represents a q-valent counter cation composed of a base having a pKa of 24 or more, and q represents an integer of 1 or more.

Abstract: A polyimide precursor composition that exhibits excellent tensile strength and breaking elongation, and that provides a film containing an alicyclic polyimide resin; a method for producing a polyimide film using the polyimide precursor composition; and a permanent film that contains an alicyclic polyimide resin and that exhibits excellent tensile strength and breaking elongation. The polyimide precursor composition is a mixture of a resin precursor component which is a polyamic acid including an alicyclic backbone having a predetermined structure, a monomer component that includes an aromatic diamine compound having a predetermined structure or an alicyclic tetracarboxylic acid di-anhydride having a predetermined structure; an imidazole compound having a predetermined structure; and a solvent.

Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component includes (I) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure.

Abstract: A silicon-containing polymer which results in a composition that forms a coated film having good adhesive properties to a substrate and does not easily peel off the substrate, a film-forming composition including the polymer, a method for forming a silicon-containing polymer coating using the composition, a method for forming a silica-based coating using the composition, and a production method for the polymer. In a silicon-containing polymer including at least one of poly- or oligo-siloxane chain and poly- or oligo-silane chain in a molecular chain, a group having a silyl group and a sulfide group, which can be subjected to a condensation reaction, is introduced into the molecular chain, for example, by an ene-thiol reaction.

Abstract: A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xm+ represents an m valent counter cation, R1 represents an aromatic group which may have a substituent; R2 represents an alkylene group which may have a substituent; R3 represents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and R2 may bond with R1 to form a cyclic structure.

Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.

Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the composition, and a crack-free silica-based coating film formed using the composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.

Abstract: An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance.

Abstract: A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

Abstract: A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.