Patents by Inventor Kunihiro Ohuchi

Kunihiro Ohuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flame-retardant polyamide composition
    Patent number: 7816438
    Abstract: To provide a polyamide resin composition which inhibits generation of a gas, formation of decomposition products and discoloration of molded articles even under high molding temperature conditions, is excellent in incombustibility and toughness, and heat resistance in a reflow soldering step being required for surface mounting. The present invention provides a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide (A), 5 to 40% by mass of a flame retardant (B), 0.01 to 0.45% by mass of an antimony compound (C) and 0.5 to 10% by mass of a salt of zinc or calcium (D).
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: October 19, 2010
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masashi Seki, Kunihiro Ohuchi
  • Flame-Retardant Polyamide Composition
    Publication number: 20090069478
    Abstract: To provide a polyamide resin composition which inhibits generation of a gas, formation of decomposition products and discoloration of molded articles even under high molding temperature conditions, is excellent in incombustibility and toughness, and heat resistance in a reflow soldering step being required for surface mounting. The present invention provides a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide (A), 5 to 40% by mass of a flame retardant (B), 0.01 to 0.45% by mass of an antimony compound (C) and 0.5 to 10% by mass of a salt of zinc or calcium (D).
    Type: Application
    Filed: March 9, 2006
    Publication date: March 12, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Masashi Seki, Kunihiro Ohuchi
  • Molding material for electrical and electronic parts
    Patent number: 6780963
    Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 24, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masahiro Sawada, Kunihiro Ohuchi
  • Molding material for electrical and electronic parts
    Publication number: 20030055210
    Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.
    Type: Application
    Filed: August 21, 2002
    Publication date: March 20, 2003
    Inventors: Masahiro Sawada, Kunihiro Ohuchi