Patents by Inventor Kunihiro Takei
Kunihiro Takei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11939492Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.Type: GrantFiled: May 13, 2022Date of Patent: March 26, 2024Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Hirokazu Iizuka, Kunihiro Takei, Yuiko Maruyama, Yuki Sato
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Patent number: 11904577Abstract: A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.Type: GrantFiled: September 28, 2020Date of Patent: February 20, 2024Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
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Patent number: 11826991Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.Type: GrantFiled: September 15, 2021Date of Patent: November 28, 2023Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
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Patent number: 11710881Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.Type: GrantFiled: March 11, 2021Date of Patent: July 25, 2023Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Kunihiro Takei, Hirokazu Iizuka, Shunsuke Takeyama
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Publication number: 20220360878Abstract: An earphone holding member includes a holder. The holder includes a side portion and a plane portion. The side portion is configured to contact at least a lower antihelix crus, an antihelix, and an antitragus of an ear. The plane portion configured to partially and planarly contact the ear.Type: ApplicationFiled: May 9, 2022Publication date: November 10, 2022Inventors: Yasuaki TAKANO, Kunihiro TAKEI
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Publication number: 20220275258Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.Type: ApplicationFiled: May 13, 2022Publication date: September 1, 2022Inventors: Hirokazu IIZUKA, Kunihiro TAKEI, Yuiko MARUYAMA, Yuki SATO
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Patent number: 11359117Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.Type: GrantFiled: December 12, 2016Date of Patent: June 14, 2022Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Hirokazu Iizuka, Kunihiro Takei, Yuiko Maruyama, Yuki Sato
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Publication number: 20220112412Abstract: Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (5), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).Type: ApplicationFiled: December 23, 2021Publication date: April 14, 2022Inventors: Hirokazu IIZUKA, Kunihiro TAKEI, Jun SUZUKI
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Publication number: 20220049131Abstract: A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.Type: ApplicationFiled: September 10, 2019Publication date: February 17, 2022Inventors: Kunihiro TAKEI, Hirokazu IIZUKA
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Patent number: 11242475Abstract: Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).Type: GrantFiled: August 2, 2018Date of Patent: February 8, 2022Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Hirokazu Iizuka, Kunihiro Takei, Jun Suzuki
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Publication number: 20220001655Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.Type: ApplicationFiled: September 15, 2021Publication date: January 6, 2022Inventors: Kunihiro TAKEI, Yuiko MARUYAMA, Hirokazu IIZUKA
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Patent number: 11148401Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.Type: GrantFiled: August 3, 2016Date of Patent: October 19, 2021Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
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Publication number: 20210203046Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.Type: ApplicationFiled: March 11, 2021Publication date: July 1, 2021Inventors: Kunihiro TAKEI, Hirokazu IIZUKA, Shunsuke TAKEYAMA
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Patent number: 11007756Abstract: The present invention relates to a hot-melt adhesive resin film which does not cause peeling between respective layers, has an excellent adhesive force, and has strong adherability even in severe durability evaluation, to various planar or film-like adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer comprise an acid-modified polyolefin resin, and a production method thereof.Type: GrantFiled: August 3, 2016Date of Patent: May 18, 2021Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Kunihiro Takei, Yuiko Maruyama, Hirokazu Iizuka
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Patent number: 10985359Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.Type: GrantFiled: February 4, 2019Date of Patent: April 20, 2021Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Kunihiro Takei, Hirokazu Iizuka, Shunsuke Takeyama
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Publication number: 20210008854Abstract: A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.Type: ApplicationFiled: September 28, 2020Publication date: January 14, 2021Inventors: Kunihiro TAKEI, Yuiko MARUYAMA, Hirokazu IIZUKA
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Patent number: 10669456Abstract: Provided are an adhesive resin composition that can be uniformly applied, has high adhesiveness, and further has high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component having a melting point of higher than 80° C. and 140° C. or lower, a crosslinking agent component, and a solvent component, in which the solvent component contains an aromatic solvent, an aliphatic solvent, and a ketone-based solvent, the aromatic solvent has a highest boiling point, and the solvent component contains the aromatic solvent in an amount of 50 parts by mass or more and 80 parts by mass or less, the aliphatic solvent in an amount of 10 parts by mass or more and 30 parts by mass or less, and the ketone-based solvent in an amount of 5 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of a total amount of the solvent component.Type: GrantFiled: August 2, 2018Date of Patent: June 2, 2020Assignee: FUJIMORI KOGYO CO., LTD.Inventors: Hirokazu Iizuka, Kunihiro Takei, Jun Suzuki
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Patent number: D867440Type: GrantFiled: April 10, 2018Date of Patent: November 19, 2019Assignee: YAMAHA CORPORATIONInventor: Kunihiro Takei
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Patent number: D907108Type: GrantFiled: September 25, 2019Date of Patent: January 5, 2021Assignee: YAMAHA CORPORATIONInventor: Kunihiro Takei
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Patent number: D1021866Type: GrantFiled: June 9, 2022Date of Patent: April 9, 2024Assignee: YAMAHA CORPORATIONInventor: Kunihiro Takei