Abstract: A printed-circuit board and a circuit unit incorporating the circuit board. The printed-circuit board capable of achieving a suitable contact area of sealing resin includes a metal circuit pattern formed on a substrate, a plurality of mounting electrodes formed on the substrate for electrically connecting at least one electronic component, a resist layer of electrically insulating material disposed over the surface of the substrate having openings in the regions corresponding to the plurality of mounting electrodes, and plurality of external connecting terminals provided on edge portions of the substrate for connecting external devices. The resist layer is preferably formed only on the area surrounding the plurality of mounting electrodes inside a sealing region, the sealing region being resin sealed over the surface of the substrate. A circuit unit is also disclosed, including an electronic device and the above-mentioned printed-circuit board.

Abstract: This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is formed on the insulating board in a process step. The resistor pattern includes the metallic material and is formed on the insulating board at a time together with the wiring pattern in the process step of the wiring pattern.