Patents by Inventor Kunihiro Tsuchiya

Kunihiro Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110188796
    Abstract: A bearing device has a shaft having a flange, a ball bearing rotatably supporting the shaft, a sleeve in which a ball bearing is fixed at an inside thereof, and an annular sealing member held between the flange and an inner ring of the ball bearing and forming a labyrinth seal in a gap between the annular sealing member and the sleeve.
    Type: Application
    Filed: January 27, 2011
    Publication date: August 4, 2011
    Inventor: Kunihiro TSUCHIYA
  • Publication number: 20110157743
    Abstract: A bearing device includes a shaft having an axis, plural rolling bearings arranged at axially separated positions and rotatably supporting the shaft, a first cylindrical member for supporting the rolling bearings therein and having a first screw on a part of an outer surface thereof, a second cylindrical member having a second screw engaging with the first screw on an inner surface thereof and mounted to the outer surface of the first cylindrical member by engaging the first screw with the second screw, a restricting member provided on the outer surface of the second cylindrical member for preventing relative axial movement of the second cylindrical member with respect to the first cylindrical member when a portion of the second member contacts the restricting member.
    Type: Application
    Filed: December 23, 2010
    Publication date: June 30, 2011
    Inventor: Kunihiro Tsuchiya
  • Patent number: 7072148
    Abstract: A pivot assembly that narrows the gap of the seal member as much as possible and can effectively restrain the diffusion of gas and dirt from the inside, and, moreover, can also solve the problem of out gas from a hub cap, is presented. The pivot assembly has ball bearings mated to both ends of a shaft, a spacer mated to a sleeve disposed between both ball bearings at the outer circumferences of these ball bearings, and has a hub cap member that covers the outside end face of the ball bearings at one end of the shaft. The hub cap is laser welded to the outer circumference of the shaft and the inner circumference of the sleeve, and after laser welding, is thin-width cut by a laser along the entire circumference at the radial middle part.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: July 4, 2006
    Assignee: Minebea Co., Ltd.
    Inventor: Kunihiro Tsuchiya
  • Patent number: 6883969
    Abstract: A pivot bearing assembly that can be easily assembled without deformation and featuring a lower amount of outgas and thermal compensation of bond strength. Further, with the pivot bearing assembly, a bearing inner ring and a shaft and a bearing outer ring and a housing are slidingly fitted, bonded and secured to each other with an ultraviolet curing type anaerobic adhesive having a high vitrification temperature, respectively.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: April 26, 2005
    Assignee: Minebea Co., Ltd.
    Inventors: Kunihiro Tsuchiya, Toshisada Koyama
  • Publication number: 20040120079
    Abstract: To supply a pivot assembly that narrows the gap of the seal member as much as possible and can effectively restrain the diffusion of gas and dirt from the inside, and, moreover, can also solve the problem of out gas from a hub cap. A pivot assembly that has mated ball bearings 2 to both ends of a shaft 1, and to the outer circumferences of these ball bearings 2 a spacer 31 has mated a sleeve 3 disposed between both ball bearings 2, and has provided a hub cap 4 member that covers the outside end face of the ball bearings at one end of the shaft 1. The hub cap 4 is laser welded to the outer circumference of the shaft 1 and the inner circumference of the sleeve 3, and after laser welding, is thin-width cut by a laser along the entire circumference at the radial middle part.
    Type: Application
    Filed: August 25, 2003
    Publication date: June 24, 2004
    Applicant: Minebea Co., Ltd.
    Inventor: Kunihiro Tsuchiya
  • Publication number: 20030156773
    Abstract: To provided a pivot bearing assembly that can be easily assembled without deformation, featuring lower amount of outgas and thermal compensation of bond strength. Further, with the pivot bearing assembly, between a bearing inner ring and a shaft, between a bearing outer ring and a housing are slidingly fitted, bonded and secured to each other with an ultraviolet curing type anaerobic adhesive having a high vitrification temperature, respectively.
    Type: Application
    Filed: February 4, 2003
    Publication date: August 21, 2003
    Inventors: Kunihiro Tsuchiya, Toshisada Koyama
  • Publication number: 20020039259
    Abstract: A magnetic recording disk device achieving higher speed, larger capacity and higher reliability. The disk device includes two or more actuator blocks that are individually and rotatably supported, and a device driver that causes a magnetic head of each of the actuator blocks to access its associated magnetic disk to arbitrarily perform read/write operations. The device driver is provided with a logic for driving, at an arbitrary RAID level, the magnetic heads of the respective actuator blocks and the magnetic disks accessed by the magnetic heads. By handling the magnetic head of each actuator block and the magnetic disk accessed by the magnetic head as one unit to implement a necessary function, a single magnetic disk device can be used as a simplified version equivalent to a RAID system.
    Type: Application
    Filed: September 14, 2001
    Publication date: April 4, 2002
    Applicant: MINEBEA CO.,LTD.
    Inventors: Toshisada Koyama, Kunihiro Tsuchiya
  • Patent number: 5060841
    Abstract: A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: October 29, 1991
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Yoshio Oshima, Yasushi Ishii, Hideki Hidaka, Kunihiro Tsuchiya