Patents by Inventor Kunihiro Yoshihara

Kunihiro Yoshihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor device and manufacturing method therefor
    Patent number: 8334598
    Abstract: A power semiconductor device includes a substrate, an element circuit pattern formed on the substrate and made of Cu covered with an electroless Ni—P plating layer, and a power semiconductor element bonded to the element circuit pattern by a solder, wherein the solder is an alloy of Sn, Sb, and Cu, and the weight percent of Cu is in the range of 0.5 to 1%, inclusive.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: December 18, 2012
    Assignees: Mitsubishi Electric Corporation, Senju Metal Industry Co., Ltd.
    Inventors: Hiroshi Nishibori, Kunihiro Yoshihara, Minoru Ueshima
  • POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
    Publication number: 20110089568
    Abstract: A power semiconductor device includes a substrate, an element circuit pattern formed on the substrate and made of Cu covered with an electroless Ni—P plating layer, and a power semiconductor element bonded to the element circuit pattern by a solder, wherein the solder is an alloy of Sn, Sb, and Cu, and the weight percent of Cu is in the range of 0.5 to 1%, inclusive.
    Type: Application
    Filed: August 25, 2010
    Publication date: April 21, 2011
    Applicants: MITSUBISHI ELECTRIC CORPORATION, Senju Metal Industry Co., Ltd.
    Inventors: Hiroshi NISHIBORI, Kunihiro Yoshihara, Minoru Ueshima
  • Electric power semiconductor device
    Patent number: 6984884
    Abstract: A main lead (2) is a single body comprised of an inner lead (2a) and an outer lead (2b) which are integrally formed, the bonding wires are arranged in parallel and fixed onto the inner lead (2a) by the wire bonding portions (3b), and the outer lead are exposed from the mold resin to the outside for electrical connection, and a plurality of through holes (8) penetrating the main terminal lead are formed in the outer vicinity of the wire bonding portions (3b) within the inner lead (2a), and the through holes are arranged substantially in parallel to the arrangement direction of the wire bonding portions (3b) so as to correspond to the entire wire bonding portions (3b).
    Type: Grant
    Filed: May 3, 2004
    Date of Patent: January 10, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masao Kikuchi, Dai Nakajima, Koichi Tsurusako, Kunihiro Yoshihara
  • Electric power semiconductor device
    Publication number: 20040251528
    Abstract: A main lead (2) is a single body comprised of an inner lead (2a) and an outer lead (2b) which are integrally formed, the bonding wires are arranged in parallel and fixed onto the inner lead (2a) by the wire bonding portions (3b), and the outer lead are exposed from the mold resin to the outside for electrical connection, and a plurality of through holes (8) penetrating the main terminal lead are formed in the outer vicinity of the wire bonding portions (3b) within the inner lead (2a), and the through holes are arranged substantially in parallel to the arrangement direction of the wire bonding portions (3b) so as to correspond to the entire wire bonding portions (3b).
    Type: Application
    Filed: May 3, 2004
    Publication date: December 16, 2004
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masao Kikuchi, Dai Nakajima, Koichi Tsurusako, Kunihiro Yoshihara