Patents by Inventor Kunihisa Kato

Kunihisa Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210098672
    Abstract: Provided is a thermoelectric conversion module that improves the solderability between a thermoelectric element layer containing a resin and a solder layer. The thermoelectric conversion module includes a first substrate having a first electrode, a second substrate having a second electrode, a thermoelectric element layer, a solder-receiving layer that directly bonds to the thermoelectric element layer, and a solder layer, wherein the first electrode of the first substrate and the second electrode of the second substrate face each other, and wherein the thermoelectric element layer is formed of a thin film of a thermoelectric semiconductor composition containing a resin, and the solder-receiving layer contains a metal material.
    Type: Application
    Filed: March 25, 2019
    Publication date: April 1, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Tsuyoshi MUTO, Yuma KATSUTA
  • Publication number: 20210036203
    Abstract: The present invention provides a thermoelectric conversion device layer having excellent durability and a method of producing the same. Specifically, the present invention provides a thermoelectric conversion device layer including a thermoelectric conversion module including, on one face of a film substrate, a thermoelectric element layer in which a P-type thermoelectric element layer and an N-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series; and further a sealing layer on the face side of the thermoelectric element layer, wherein the sealing layer has a water vapor transmission rate at 40° C. and 90% RH, as prescribed in JIS K7129:2008, of 1,000 g·m?2·day?1 or less; and a method of producing the same.
    Type: Application
    Filed: March 29, 2018
    Publication date: February 4, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTO
  • Publication number: 20210036202
    Abstract: The present invention is to provide a thermoelectric conversion module capable of maintaining a thermoelectric performance and revealing excellent insulation properties and a method of producing the same. Provided are a thermoelectric conversion module including a heat dissipation layer via an insulating layer on at least one face of a thermoelectric element layer being one in which a p-type thermoelectric element layer and an n-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series, wherein the insulating layer has an elastic modulus at 23° C. of 0.1 to 500 GPa, and a method of producing the same.
    Type: Application
    Filed: October 24, 2017
    Publication date: February 4, 2021
    Applicant: LINTEC Corporation
    Inventors: Yusuke HARA, Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTO
  • Publication number: 20200144471
    Abstract: Provided are an electrode material for thermoelectric conversion modules capable of preventing cracking and peeling of electrodes that may occur at the bonding parts of a thermoelectric element and an electrode under high-temperature conditions to thereby maintain a low resistance at the bonding parts, and a thermoelectric conversion module using the material.
    Type: Application
    Filed: March 13, 2018
    Publication date: May 7, 2020
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTO, Yuma KATSUTA
  • Publication number: 20200066960
    Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.
    Type: Application
    Filed: December 7, 2017
    Publication date: February 27, 2020
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTOU, Yuma KATSUTA, Takeshi KONDO
  • Publication number: 20190378967
    Abstract: Provided are a flexible thermoelectric conversion device having high thermoelectric performance and capable of imparting a sufficient temperature difference in an in-plane direction to the thermoelectric elements inside the thermoelectric conversion module therein, and a method for producing the device. The flexible thermoelectric conversion device includes a thermoelectric conversion module having P-type thermoelectric elements and N-type thermoelectric elements alternately arranged to be adjacent to each other on one face of a film substrate, and includes a high thermally conductive layer composed of a high thermally conductive material in a part of a position on one face of the thermoelectric conversion module, which is on the side of the other face of the film substrate, among both faces of the thermoelectric conversion module, in which the thermal conductivity of the high thermally conductive layer is 5 to 500 (W/m·K), and the production method produces the device.
    Type: Application
    Filed: January 24, 2018
    Publication date: December 12, 2019
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTOU, Takeshi KONDO
  • Patent number: 10490724
    Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: November 26, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Tsuyoshi Mutou, Wataru Morita, Yuma Katsuta, Takeshi Kondo
  • Patent number: 10403807
    Abstract: The present invention provides a thermoelectric conversion material having a reduced thermal conductivity and having an improved figure of merit, and a method for producing the material. The thermoelectric conversion material has, as formed on a resin substrate having recesses, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the resin substrate comprises one formed by curing a resin layer of a curable resin composition. The production method for the thermoelectric conversion material comprises a resin substrate formation step of transcribing a protruding structure from an original plate having the protruding structure onto a resin layer of a curable resin composition and curing the layer, and a film formation step of forming a thermoelectric semiconductor layer of a thermoelectric semiconductor material on the resin substrate.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: September 3, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Tsuyoshi Mutou
  • Patent number: 9944831
    Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: April 17, 2018
    Assignee: LINTEC CORPORATION
    Inventors: Wataru Morita, Kunihisa Kato, Tsuyoshi Mutou
  • Publication number: 20170373240
    Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.
    Type: Application
    Filed: December 24, 2015
    Publication date: December 28, 2017
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Tsuyoshi MUTOU, Wataru MORITA, Yuma KATSUTA, Takeshi KONDO
  • Patent number: 9691961
    Abstract: The present invention provides a thermoelectric conversion material having a low thermal conductivity and having an improved figure of merit, and a method for producing it. The thermoelectric conversion material has, as formed on a substrate having a nano-level microporous nanostructure, a thermoelectric semiconductor layer prepared by forming a thermoelectric semiconductor material into a film, wherein the substrate is a block copolymer substrate formed of a block copolymer that comprises a polymethyl methacrylate unit and a polyhedral oligomeric silsesquioxane-containing polymethacrylate unit, and the thermoelectric semiconductor material is a p-type bismuth telluride or an n-type bismuth telluride. The production method comprises a substrate formation step of forming the nanostructure-having block copolymer substrate, and a film formation step of forming a p-type bismuth telluride or an n-type bismuth telluride into a film to thereby provide a thermoelectric semiconductor layer.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: June 27, 2017
    Assignees: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, LINTEC CORPORATION
    Inventors: Kunihisa Kato, Chihaya Adachi, Koji Miyazaki, Teruaki Hayakawa
  • Patent number: 9620697
    Abstract: The present invention provides a thermoelectric conversion material of which the structure is controlled to have nano-order microscopic pores and which has a low thermal conductivity and has an improved thermoelectric performance index. In the thermoelectric conversion material having a thermoelectric semiconductor layer formed on a block copolymer substrate that comprises a block copolymer having microscopic pores, wherein the block copolymer comprises a polymer unit (A) formed of a monomer capable of forming a homopolymer having a glass transition temperature of 50° C. or higher, and a polymer unit (B) formed of a conjugated dienic polymer.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: April 11, 2017
    Assignees: KYUSHU INSTITUTE OF TECHNOLOGY, LINTEC CORPORATION
    Inventors: Tsuyoshi Mutou, Koji Miyazaki, Yoshika Hatasako, Kunihisa Kato
  • Patent number: 9608190
    Abstract: The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: March 28, 2017
    Assignees: LINTEC CORPORATION, KYUSHU INSTITUTE OF TECHNOLOGY
    Inventors: Kunihisa Kato, Tsuyoshi Mutou, Koji Miyazaki, Aiko Harada
  • Patent number: 9461228
    Abstract: The present invention provides a thermoelectric conversion material excellent in thermoelectric performance and flexibility and capable of being produced in a simplified manner and at a low cost, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles and a conductive polymer, and the method for producing a thermoelectric conversion material includes a step of applying the thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles and a conductive polymer onto the support and drying it to forma thin film thereon.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: October 4, 2016
    Assignees: LINTEC CORPORATION, KYUSHU INSTITUTE OF TECHNOLOGY
    Inventors: Kunihisa Kato, Tsuyoshi Mutou, Koji Miyazaki
  • Patent number: 9431593
    Abstract: The present invention provides a thermoelectric conversion material capable of being produced in a simplified manner and at a low cost and excellent in thermoelectric conversion characteristics and flexibility, and provides a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid comprises a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: August 30, 2016
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Tsuyoshi Mutou, Takeshi Kondo
  • Publication number: 20160222256
    Abstract: The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.
    Type: Application
    Filed: September 24, 2014
    Publication date: August 4, 2016
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTOU
  • Publication number: 20160215172
    Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.
    Type: Application
    Filed: September 24, 2014
    Publication date: July 28, 2016
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTOU
  • Patent number: 9401490
    Abstract: The present invention provides a transparent conductive film which is low in terms of surface resistivity and high in terms of transparency. The transparent conductive film according to the present invention includes an adhesive conductive layer in openings of a conductive metal mesh layer provided on at least one surface of a transparent base material, wherein the conductive layer is composed of a conductive adhesive composition containing (A) a water-soluble vinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, the organic additive (B) is at least one member selected among water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected among polyanilines, polypyrroles, polythiophenes, and derivatives thereof.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: July 26, 2016
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Tsuyoshi Muto, Kazue Uemura, Emi Nakajima
  • Publication number: 20160013391
    Abstract: The invention provides a thermoelectric conversion material having a low thermal conductivity and an improved figure of merit and a production method for the material, and also provides a thermoelectric conversion module. The thermoelectric conversion material has, on a porous substrate having microscopic pores, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the porous substrate has a polymer layer (B) on a plastic film (A) and the microscopic pores are formed in the polymer layer (B) and in a part of the plastic film (A). The production method for the thermoelectric conversion material comprises a substrate formation step of forming a porous substrate including a step 1, a step 2 and a step 3, and comprises a film formation step of forming a thermoelectric semiconductor layer through film formation of a thermoelectric semiconductor material on the porous substrate. The thermoelectric conversion module uses the thermoelectric conversion material.
    Type: Application
    Filed: February 18, 2014
    Publication date: January 14, 2016
    Applicants: LINTEC CORPORATION, KYUSHU INSTITUTE OF TECHNOLOGY
    Inventors: Kunihisa KATO, Tsuyoshi MUTOU, Koji MIYAZAKI, Aiko HARADA
  • Patent number: 9159940
    Abstract: An electronic device having, arranged in the following order, a cathodic layer, a conductive layer, a photoelectric conversion layer, and an anodic layer. The conductive layer contains a conductive adhesive composition which contains: (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: October 13, 2015
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Tsuyoshi Muto, Emi Nakajima