Patents by Inventor Kuniji Koike

Kuniji Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7929272
    Abstract: A dielectric device having a dielectric layer and first to nth metal layers (where n is an integer of 2 or greater) in contact with the dielectric layer. At least one of the first to nth metal layers contains a base metal. Interfaces between the first to nth metal layers and the dielectric layer have respective arithmetic mean roughnesses of Ra1 to Ran (nm), while an average value Ram (nm) of the arithmetic mean roughnesses of Ra1 to Ran (nm) and a thickness T (nm) of the dielectric layer satisfy T/Ram ?1.3.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: April 19, 2011
    Assignee: TDK Corporation
    Inventors: Shinichiro Kakei, Hitoshi Saita, Kuniji Koike, Kenji Horino
  • Publication number: 20070278627
    Abstract: A dielectric device comprises a dielectric layer and first to nth metal layers (where n is an integer of 2 or greater) in contact with the dielectric layer. At least one of the first to nth metal layers contains a base metal. Interfaces between the first to nth metal layers and the dielectric layer have respective arithmetic mean roughnesses of Ra1 to Ran (nm), while an average value Ram (nm) of the arithmetic mean roughnesses of Ra1 to Ran (nm) and a thickness T (nm) of the dielectric layer satisfy T/Ram?1.3.
    Type: Application
    Filed: June 4, 2007
    Publication date: December 6, 2007
    Applicant: TDK CORPORATION
    Inventors: Shinichiro Kakei, Hitoshi Saita, Kuniji Koike, Kenji Horino