Abstract: A wafer lift-out apparatus for lifting out, from a container in which a plurality of semiconductor wafers and a spacer are housed in such a manner that the semiconductor wafers and the spacer are alternately stacked and that a part of the spacer is exposed from between the semiconductor wafers, one of the semiconductor wafers includes: a wafer suction mechanism for sucking the semiconductor wafers; a carrying mechanism for carrying the wafer suction mechanism; and a spacer retaining mechanism for retaining the part of the spacer. The spacer retaining mechanism retains the part of the spacer when the carrying mechanism lifts up the wafer suction mechanism while the wafer suction mechanism sucks one of the semiconductor wafers housed in the container.

Abstract: A tip of a wire is formed in a shape of a ball, the wire being inserted into and fed out of a first tool. The tip is bonded to a first electrode by using the first tool. The wire is drawn from the first tool and a part of the wire is bonded to a second electrode by using the first tool. The wire is held by a second tool disposed above the first tool, and cut in a state to allow the part of the wire to remain on the second electrode. The wire is fed out of the first tool by positioning the first and second tools relatively closer to each other while holding the wire by the second tool.

Abstract: Thermal oxidation of lead frames is provided to thereby improve the adhesion with resin. The method includes the steps of disposing a lead frame having die pads on which semiconductor chips are respectively mounted in a bonding apparatus, and wire-bonding electrodes of the semiconductor chips and leads of the lead frame. The bonding apparatus includes a bonding stage and a stand-by stage. A heat section is provided in the bonding stage. The die pad of the lead frame is disposed in the bonding stage and the remaining die pads are disposed in the stand-by stage. The die pads disposed in the stand-by stage are placed in a non-contact state with the heat section, while the die pad disposed in the bonding stage is brought in contact with the heat section to be heated and wire-bonded.