Patents by Inventor Kuninori Itou

Kuninori Itou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Masking material
    Patent number: 7422785
    Abstract: The object of the present invention is to protect completely a part of an article having penetrating hole(s) from a surface treatment. To attain said object, a masking member (1A), having fitting part(s) (11A) to fit into said hole(s) of said article, the bottom end(s) of said fitting part(s) reaching the end(s) of said hole(s), and flange(s) (13A) being formed around bottom end(s) of said fitting part(s) around the circumference(s) of said hole(s), is provided.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: September 9, 2008
    Assignee: Nagoya Oilchemical Co., Ltd.
    Inventors: Masanori Ogawa, Kuninori Itou
  • Masking material
    Patent number: 7172808
    Abstract: The object of the present invention is to provide a masking member(11) which has good heat resistance and can be used repeatedly. To attain this object, the present invention provides a masking member made of a polymer alloy having a sea-island structure containing polyolefin in a continuous phase and one or more kind(s) of engineering plastic selected from among a group consisting of methyl pentene copolymer, polysulphone, polyethersulphone, polyphenylenesulphide, polyphenyleneether, polyamideimide, polyetherimide, and polyether-etherketone in a dispersed phase.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: February 6, 2007
    Assignee: Nagoya Oilchemical Co., Ltd.
    Inventors: Masanori Ogawa, Kuninori Itou
  • Resin composition, molding material, and molded object
    Patent number: 6794034
    Abstract: A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: September 21, 2004
    Assignee: Nagoya OilChemical Co., Ltd.
    Inventors: Masanori Ogawa, Seinosuke Horiki, Takehiko Kajita, Kuninori Itou
  • Resin composition, molding material, and molded object
    Publication number: 20030088025
    Abstract: A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity.
    Type: Application
    Filed: August 7, 2002
    Publication date: May 8, 2003
    Inventors: Masanori Ogawa, Seinosuke Horiki, Takehiko Kajita, Kuninori Itou