Patents by Inventor Kunio Akedo
Kunio Akedo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220392677Abstract: A dust core contains magnetic nanoparticles whose average particle size is 1 to 300 nm, and an aromatic compound that includes two or more functional groups of at least one type selected from a group consisting of a carboxy group and a hydroxy group.Type: ApplicationFiled: October 21, 2020Publication date: December 8, 2022Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Rie TAGUCHI, Kunio AKEDO, Takanori MURASAKI, Takahiro OKAZAKI
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Publication number: 20200365410Abstract: An etching device may include a reservoir storing an etchant, a support member configured to support the semiconductor wafer in a state where a first surface of the semiconductor wafer is immersed in the etchant, a light source configured to irradiate the first surface of the semiconductor wafer supported by the support member with light emitted from the light source, an electrode disposed in the reservoir, and a power source configured to apply a current between the electrode and the semiconductor wafer supported by the support member, the current changing between a first current value and a second current value larger than the first current value.Type: ApplicationFiled: April 2, 2020Publication date: November 19, 2020Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Daisuke SUGIZAKI, Kunio AKEDO, Koji NODA, Eiko ISHII, Kenji NAKASHIMA
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Publication number: 20200279760Abstract: An etching device may include a reservoir storing an etchant, a support member configured to rotatably support the semiconductor wafer in a state where a first surface of the semiconductor wafer is immersed in the etchant, a light source configured to emit light to the first surface of the semiconductor wafer, a counter electrode disposed in the reservoir and disposed between the support member and the light source, and a power source configured to apply a voltage between the semiconductor wafer and the counter electrode. When the light source emits light, a lighted area by the light and a shadow of the counter electrode may be projected onto the first surface of the semiconductor wafer, and when the semiconductor wafer is rotated by the support member, at least a part of the first surface may pass both the lighted area and the shadow.Type: ApplicationFiled: February 14, 2020Publication date: September 3, 2020Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Daisuke SUGIZAKI, Eiko Ishii, Kenji Nakashima, Kunio Akedo, Koji Noda
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Patent number: 8461572Abstract: There is provided a polymer or low-molecular-weight compound multilayer type organic EL device configured such that a light-emitting layer formed on a hole transport layer includes a mixture of a polymer material and a low-molecular weight material. With such a configuration, the low-molecular-weight material added to the polymer material serves as a binder filling the gap of the steric hindrance to form entanglement of the polymer material and the low-molecular-weight material. This results in that the interface between the hole transport layer and the light-emitting layer is an interface high in adhesion and also high in carrier injectability. Further, optimization of the formation conditions and materials can achieve still higher reliability and longer lifetime.Type: GrantFiled: May 14, 2009Date of Patent: June 11, 2013Assignees: DENSO CORPORATION, Kabushiki Kaisha Toyota Chuo KenkyushoInventors: Masayuki Katayama, Kazushige Kojima, Tetsuya Katoh, Kunio Akedo, Toshikazu Satoh, Koji Noda, Tomohiko Mori, Yoshihiro Kikuzawa, Koichi Sakaguchi
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Patent number: 8026578Abstract: A barrier film formed on top of a substrate, a barrier film formed so as to cover a functional element region fabricated on top of a substrate, or a barrier film formed on both a substrate and a functional element region, wherein the barrier film includes at least one layer of a silicon nitride film formed by laminating two or more silicon nitride layers having different Si/N composition ratios.Type: GrantFiled: February 29, 2008Date of Patent: September 27, 2011Assignee: Kabushiki Kaisha Toyota Chuo KenkyushoInventors: Kunio Akedo, Atsushi Miura, Koji Noda, Hisayoshi Fujikawa
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Publication number: 20110006288Abstract: There is provided a polymer or low-molecular-weight compound multilayer type organic EL device configured such that a light-emitting layer formed on a hole transport layer includes a mixture of a polymer material and a low-molecular weight material. With such a configuration, the low-molecular-weight material added to the polymer material serves as a binder filling the gap of the steric hindrance to form entanglement of the polymer material and the low-molecular-weight material. This results in that the interface between the hole transport layer and the light-emitting layer is an interface high in adhesion and also high in carrier injectability. Further, optimization of the formation conditions and materials can achieve still higher reliability and longer lifetime.Type: ApplicationFiled: May 14, 2009Publication date: January 13, 2011Inventors: Masayuki Katayama, Kazushige Kojima, Tetsuya Katoh, Kunio Akedo, Toshikazu Satoh, Koji Noda, Tomohiko Mori, Yoshihiro Kikuzawa, Koichi Sakaguchi
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Publication number: 20080211066Abstract: A barrier film formed on top of a substrate, a barrier film formed so as to cover a functional element region fabricated on top of a substrate, or a barrier film formed on both a substrate and a functional element region, wherein the barrier film includes at least one layer of a silicon nitride film formed by laminating two or more silicon nitride layers having different Si/N composition ratios.Type: ApplicationFiled: February 29, 2008Publication date: September 4, 2008Applicant: KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHOInventors: Kunio Akedo, Atsushi Miura, Koji Noda, Hisayoshi Fujikawa
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Patent number: 7279239Abstract: In a laminate product formed by an organic member and/or an inorganic member, high strength adhesion between the organic member and the inorganic member is achieved by providing an adhesion layer which includes amorphous carbon nitride (a-CNx:H) particularly between the organic member and the inorganic member. Further, in order to protect a laminate product formed by an organic member and/or an inorganic member, for example, an organic electronic element including an organic compound layer, such as an organic electroluminescence element, a protective film including at least amorphous carbon nitride and a protective layer having a laminate structure formed by sandwiching a vapor deposition inorganic film between plasma polymerized films are used. Thus, a protective film which is optimum to an organic electronic element, having high bending stress resistance, high shielding effect against moisture and oxygen existing in the air, and excellent resistance to high temperature and high humidity can be provided.Type: GrantFiled: August 7, 2003Date of Patent: October 9, 2007Assignee: Kabushiki Kaisha Toyota Chuo KenkyushoInventors: Kunio Akedo, Koji Noda, Atsushi Miura, Hisayoshi Fujikawa, Yasunori Taga
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Publication number: 20040247949Abstract: In a laminate product formed by an organic member and/or an inorganic member, high strength adhesion between the organic member and the inorganic member is achieved by providing an adhesion layer which includes amorphous carbon nitride (a-CNx:H) particularly between the organic member and the inorganic member. Further, in order to protect a laminate product formed by an organic member and/or an inorganic member, for example, an organic electronic element including an organic compound layer, such as an organic electroluminescence element, a protective film including at least amorphous carbon nitride and a protective layer having a laminate structure formed by sandwiching a vapor deposition inorganic film between plasma polymerized films are used. Thus, a protective film which is optimum to an organic electronic element, having high bending stress resistance, high shielding effect against moisture and oxygen existing in the air, and excellent resistance to high temperature and high humidity can be provided.Type: ApplicationFiled: April 12, 2004Publication date: December 9, 2004Inventors: Kunio Akedo, Koji Noda, Atsushi Miura, Hisayoshi Fujikawa, Yasunori Taga