Abstract: A method of manufacturing a magnetic recording medium includes providing a substrate that is a magnetic recording medium substrate having a disc shape, having two main surfaces, and having defined therein a center hole; holding the center hole of the substrate from both main surfaces with two holding members that each have a disc shape to hold the substrate and to cover at least the periphery of the center hole adjacent to the two main surfaces of the substrate; and applying resist liquid simultaneously to both main surfaces of the substrate using spin coating to form a resist layer simultaneously on both main surfaces while maintaining the periphery of the center hole immediately adjacent to the two main surfaces of the substrate resist-free as an unapplied portion. The method enables efficient formation of uniform resist layers without defects on both faces of the substrate.

Abstract: A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.

Abstract: A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

Abstract: A method of manufacturing a magnetic recording medium includes providing a substrate that is a magnetic recording medium substrate having a disc shape, having two main surfaces, and having defined therein a center hole; holding the center hole of the substrate from both main surfaces with two holding members that each have a disc shape to hold the substrate and to cover at least the periphery of the center hole adjacent to the two main surfaces of the substrate; and applying resist liquid simultaneously to both main surfaces of the substrate using spin coating to form a resist layer simultaneously on both main surfaces while maintaining the periphery of the center hole immediately adjacent to the two main surfaces of the substrate resist-free as an unapplied portion. The method enables efficient formation of uniform resist layers without defects on both faces of the substrate.

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract: Based on information indicating the signal transmission amount between the first and second circuit blocks, a switching device switches an optical signal communication form which uses a first and second optical signal transmitting/receiving devices and an electric signal communication form which uses a first and second electric signal transmitting/receiving devices. Thereby, in a portable information terminal apparatus with a separate main body operation unit and a separate screen display unit, power consumed by the optical signal communication can be suppressed.

Abstract: A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.

Abstract: A press die and a molding process can form a disk member having a shaft shaped portion at a center with satisfactory circularity and flatness in a disk portion, dimensional precision in the shaft shaped portion, and concentricity between the disk portion and the shaft shaped portion at the center. The press die is designed for press molding of a glass substrate of a disk member with a shaft shaped portion at a center thereof. The press die includes an upper die forming an upper surface of the disk member, an intermediate die having a shaft forming hole portion for forming a shaft shaped portion projecting from a disk portion of the disk member, a lower die for forming a lower surface of the shaft shaped portion and a guide member for guiding the upper die, the intermediate die and the lower die.

Abstract: A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

Abstract: A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.

Abstract: A method of manufacturing a glass substrate for a storage medium by pressing a glass material between an upper and a lower dies. The method includes a heating step of heating the glass material arranged between the upper and lower dies, a pressing step of pressing the heated glass material via the upper and lower dies, and a cooling step of having, after the pressing step, a cooling member contact the upper and lower dies to cool them together with the molded glass material arranged between the upper and lower dies. During the heating step and the pressing step, a vacuum atmosphere is maintained in a space containing the dies and the glass material. When the pressing step has completed, an inert gas is filled in the space to set a pressure in the space equal to an ambient pressure.

Abstract: A portable device has a configuration such that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device includes a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that their relative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

Abstract: A press die and a molding process can form a disk member having a shaft shaped portion at a center with satisfactory circularity and flatness in a disk portion, dimensional precision in the shaft shaped portion, and concentricity between the disk portion and the shaft shaped portion at the center. The press die is designed for press molding of a glass substrate of a disk member with a shaft shaped portion at a center thereof. The press die includes an upper die forming an upper surface of the disk member, an intermediate die having a shaft forming hole portion for forming a shaft shaped portion projecting from a disk portion of the disk member, a lower die for forming a lower surface of the shaft shaped portion and a guide member for guiding the upper die, the intermediate die and the lower die.

Abstract: A press die and a molding process can form a disk member having a shaft shaped portion at a center with satisfactory circularity and flatness in a disk portion, dimensional precision in the shaft shaped portion, and concentricity between the disk portion and the shaft shaped portion at the center. The press die is designed for press molding of a glass substrate of a disk member with a shaft shaped portion at a center thereof. The press die includes an upper die forming an upper surface of the disk member, an intermediate die having a shaft forming hole portion for forming a shaft shaped portion projecting from a disk portion of the disk member, a lower die for forming a lower surface of the shaft shaped portion and a guide member for guiding the upper die, the intermediate die and the lower die.

Abstract: Based on information indicating the signal transmission amount between the first and second circuit blocks, a switching device switches an optical signal communication form which uses a first and second optical signal transmitting/receiving devices and an electric signal communication form which uses a first and second electric signal transmitting/receiving devices. Thereby, in a portable information terminal apparatus with a separate main body operation unit and a separate screen display unit, power consumed by the optical signal communication can be suppressed.

Abstract: Provided is a portable device having such a configuration that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device comprising: a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that the irrelative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

Abstract: A wavelength multiplexing device has an emitter capable of independently emitting at least two optical signals for at least two kinds of wavelength, respectively and a transmitter including a plurality of optical waveguides into which the optical signals emitted by the emitter are coupled and which independently transmit the coupled optical signals, respectively. While coupling optical signals with the same wavelength among the optical signals emitted by the emitter into the optical waveguides different from each other, the transmitter couples optical signals with wavelengths different from each other into a same optical waveguide.

Abstract: An optical waveguide includes a first cladding, a second cladding, and a core. The core is embedded in the first cladding so as to be exposed on one principal surface of the first cladding that is opposed to the second cladding. The first cladding and the second cladding are arranged so as to sandwich the core. The core is a product formed by a reaction in which a polymeric material that includes branched polysilane and polysiloxane is subjected to at least one process selected from heating and ultraviolet irradiation. The refractive index of the core is higher than the refractive indices of the first cladding and the second cladding.