Abstract: A rotational misalignment between semiconductor wafers constituting a bonded wafer is calculated. A light source is arranged at a position which is on a front side of an opening of a notch and which is separated from an outer edge portion of a bonded wafer by a predetermined interval, and outputs light to irradiate the outer edge portion of the bonded wafer including the notch. A camera receives and photoelectrically converts reflected light that is specularly-reflected by the outer edge portion of the bonded wafer including the notch among the light outputted by the light source in order to output a brightness distribution of the reflected light as an image. A computer analyzes positions of notches from the image outputted by the camera to obtain a notch position misalignment, and further calculates a rotational misalignment between semiconductor wafers using a center position misalignment between the semiconductor wafers.

Abstract: A rotational misalignment between semiconductor wafers constituting a bonded wafer is calculated. A light source is arranged at a position which is on a front side of an opening of a notch and which is separated from an outer edge portion of a bonded wafer by a predetermined interval, and outputs light to irradiate the outer edge portion of the bonded wafer including the notch. A camera receives and photoelectrically converts reflected light that is specularly-reflected by the outer edge portion of the bonded wafer including the notch among the light outputted by the light source in order to output a brightness distribution of the reflected light as an image. A computer analyzes positions of notches from the image outputted by the camera to obtain a notch position misalignment, and further calculates a rotational misalignment between semiconductor wafers using a center position misalignment between the semiconductor wafers.

Abstract: According to the present invention, the image input apparatus is adapted to sample the image signal read by the linear image sensor by means of the sampling means in order to output image data.

Abstract: A method and apparatus measure the lifetime of a semiconductor material by directing microwave energy into the semiconductor material and by producing carriers within the semiconductor material by impinging light thereon. A non-metal material is interposed between the semiconductor material and a metallic surface, such that a portion of the microwave energy travels through the semiconductor material and the non-metal material and reflects off of the metallic surface and back through the non-metal material and the semiconductor material. Additionally, a heating member is provided for heating the semiconductor material, whereby the lifetime of the semiconductor material is determined according to characteristics of the reflected microwave energy and the temperature of the semiconductor material.

Abstract: According to this invention, since black regions are provided along the advancing direction on an original plate, the dark-time output levels of the linear sensor would not be affected by dust adhered on the original plate or the presence of trimming lines. Since a calibration region is provided, the circuit system can be calibrated with the maximum and minimum values of the signals from the linear sensor to thereby achieve more precise reading of images.

Abstract: Road surface condition detection system comprising light projector means for projecting light including the infrared region of the spectrum to a road surface to sense the condition thereof, the infrared having wavelengths at which the reflectance of snow is smaller than that of the road surface in a dry condition, light receiving means for receiving light reflected from the road surface, comparisons means for comparing the output signals generated from the light receiving means with reference signal levels corresponding to dry, wet, snowy and frozen conditions, and judging means for judging the road surface to be one of the conditions in accordance with results of comparison.